... meniscus capillary pressure phase change screen wicks ansys fluent multiphase CFD VOF model electronics cooling heat pipes thermosyphons evaporation-driven flow heat and mass transfer Heat pipes, vapor chambers, thermosyphons, and other two-phase thermal management devices are widely...

...-conductivity inserts for both types of boundary conditions. However, these locations do not coincide. e-mail:  vafai@engr.ucr.edu 31 01 2021 09 04 2021 08 09 2021 electronics cooling 3D IC heat spreader high-conductivity insert optimization Thermal management...

...-mail:  xuezhihu9@hotmail.com 11 09 2018 20 10 2019 13 01 2020 loop heat pipe two-phase device electronics cooling temperature control thermal resistance As core numbers of computer chip and its computing performance desires increase rapidly but its packaging becomes...

..., and channel aspect ratio. The outcome of this study indicates the possible use of recharging microchannel heat sinks for high heat flux removal applications such as electronic cooling. e-mail:  mkmoharana@gmail.com 17 05 2019 31 08 2019 08 11 2019 recharging microchannel...

... Passages ,” Int. J. Therm. Sci. , 46 ( 11 ), pp. 1191 – 1202 . 10.1016/j.ijthermalsci.2007.06.010 [16] Wei , X. , and Joshi , Y. , 2002 , “ Optimization Study of Stacked Micro-Channel Heat Sinks for Micro-Electronic Cooling ,” Proceedings of the ITherm 2002 , San Diego, CA, June 1, pp...

.... Phenom. J. , 2 , pp. 24 – 34 . [15] Hosseini , R. , Gholaminejad , A. , and Nabil , M. , 2011 , “ Concerning the Effect of Surface Material on Nucleate Boiling Heat Transfer of R-113 ,” Electron. Cool. Therm. Control , 1 , pp. 22 – 27 . 10.4236/jectc.2011.12003 [16...

... This work demonstrates an innovative microfabricated air-cooling technology that employs an electrohydrodynamic (EHD) corona discharge (i.e., ionic wind pump) for electronics cooling applications. A single, microfabricated ionic wind pump element consists of two parallel collecting electrodes between which...

... 2013 13 11 2013 This work focuses on a comparison of second law based component design on one hand and second law based system design on the other within the context of electronics cooling. Typical electronics cooling components such as a heat sink and a heat exchanger are modeled...

.... 16 05 2013 10 12 2013 Boiling can provide several orders of magnitude higher performance than a traditional air cooled system in electronics cooling applications. It can dissipate large quantities of heat while maintaining a low surface temperature difference. Flow boiling...

... – 52 . 10.1109/TCAPT.2008.2004412 [6] Ndao , S. , Peles , Y. , and Jensen , M. K. , 2009 , “ Multi-Objective Thermal Design Optimization and Comparative Analysis of Electronics Cooling Technologies ,” Int. J. Heat Mass Transfer , 52 ( 19-20 ), pp. 4317 – 4326 . 10.1016...

... than steady jets in the Reynolds number range of 100 to 3000. We attribute the superior performance of synthetic jets to vortex shedding associated with the unsteady flow. synthetic jets pulsating flow steady jets electronics cooling unsteady heat transfer impingement cooling...

...% is observed, increasing to positive enhancements for Sr(H/D) > 0.1 up to a maximum enhancement of 48% at Sr(H/D) = 0.6. impinging jet pulsating flow hot spot high density electronics cooling boundary layer redevelopment A recent review by Garimella et al. [ 1 ] outlines the challenges...

... temperature distribution. synthetic jet microchannel flow boiling instability two-phase flow electronics cooling Flow boiling heat transfer in microchannels has shown great potential for removal of high heat flux in the thermal management of high power density electronics, microprocessors...

... w is the wall temperature. The nondimensional velocity s is given by (5) s = u 2 k b T / m g = u c At room temperature, c is on the order of 300 m/s, while the velocity through electronic cooling systems is in the order of 1 m/s...

... fabrication processes. This approach may eventually be employed to design intricate sintered porous structures with desired properties tailored to specific applications. porous media sintered materials direct simulation microtomography reverse engineering electronics cooling thermal and fluid...

... in electronics cooling application. Wu and Cheng [ 5 ] conducted a series of experiments using trapezoidal microchannels over a range of heat and mass fluxes. They observed three kinds of unstable modes: (1) liquid/two-phase alternating flow at low heat flux and high mass flux, (2) continuous two-phase flow...

... for Electronics Cooling ,” 4th International Symposium on Heat Transfer and Energy Conservation, Guangzhou , China, pp. 142 – 146 . [12] Kittel , C. , 1986 , Introduction to Solid State Physics , 6th ed. , Wiley , New York . [13] Ziman , J. M. , 1960 , Electrons and Phonons , Oxford...

.... [ 14 ]. Optimization of fin spacing in heat sinks is of broad interest in electronics cooling. Traditionally, the input variables are assumed to be deterministic for such an optimization, while in reality there could be uncertainties in both dimensions and operating conditions. In this work, a pin...

... in the channels. microchannel oscillation reduction inlet orifice signal analysis two-phase flow electronics cooling The removal of high heat flux from electronics devices continues to be a problem, especially for defense applications. For electronics cooling, it is desirable to maintain...

... flow in a single-phase liquid flow heat sink, for use in electronics cooling. This initial study uses a single rectangular channel (1.9 mm hydraulic diameter) serving as a reference case for subsequent studies of pulsating flow in parallel microchannels or other microscale geometries...