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Journal Articles

Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits With Nonuniform Heat Flux

Yoon Jo Kim, Yogendra K. Joshi, Andrei G. Fedorov, Young-Joon Lee, Sung-Kyu Lim
Journal: Journal of Heat Transfer
Article Type: Research Papers
J. Heat Transfer. April 2010, 132(4): 041009.
https://doi.org/10.1115/1.4000885
Published Online: February 19, 2010
... integrated circuit interconnections integrated circuit packaging microchannel flow microprocessor chips refrigerants thermal management (packaging) two-phase flow 02 02 2009 25 09 2009 19 02 2010 19 02 2010 2010 American Society of Mechanical Engineers ...
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Topics: Cooling, Heat flux, Microfluidics, Flow (Dynamics), Pressure drop, Integrated circuits, Fluids, Thermal management, Refrigerants
Journal Articles

Evaporative Thermal Performance of Vapor Chambers Under Nonuniform Heating Conditions

Je-Young Chang, Ravi S. Prasher, Suzana Prstic, P. Cheng, H. B. Ma
Journal: Journal of Heat Transfer
Article Type: Research Papers
J. Heat Transfer. December 2008, 130(12): 121501.
https://doi.org/10.1115/1.2976786
Published Online: September 23, 2008
... microprocessor chips porosity silicon statistical analysis thermal management (packaging) thermal resistance heat pipe vapor chamber nonuniform heating evaporative thermal performance silicon die heater As integrated circuit (IC) technology evolves for microprocessors, components inside IC...
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Topics: Copper, Heat flux, Heating, Silicon, Vapors, Thermal resistance, Heat, Heat pipes