... the sonication cycle was completed, the mixture was then placed in a three roll milling processor for six successive cycles incrementally reduced from 20 to 5 μ m gap spacings at 140 rpm. Epikure curing agent W was then added to the modified resin and mixed using a high-speed mechanical stirrer. To reduce...

...Z. Ahmad; M. P. Ansell; D. Smedley Adhesives used for bonded-in steel or composite pultruded rods and plate to make connections in timber structures are commonly room temperature cure adhesives. The room temperature cure, applied without pressure, thixotropic, and shear thinning characteristics...

...Mrinal C. Saha; Bipul Barua; Sriram Mohan Cure kinetic behavior was studied for both thermosetting polyurethane (PU) solids and foams. The effects of cure temperature, foam density, and carbon nanofiber (CNF) contents were examined. Cure studies were performed experimentally by measuring...

...Z. Ahmad; M. P. Ansell; D. Smedley The environmental stability of three room temperature cure epoxy adhesives was evaluated following exposure to temperatures of 20 ° C , 30 ° C , and 50 ° C at 95%RH, to 50 ° C in air and soaked in water for up to 90 days. The adhesives contained nano...

...% to maintain light weight structures. Several FGSF specimens having similar density are fabricated with different layer arrangements. The different layers are integrated before major solidification takes place. Quasistatic compression testing is then performed on the cured FGSF samples using MTS-810...

...G. J. Tsamasphyros; Th. K. Papathanassiou; S. I. Markolefas In this paper, we derive some analytical solutions of the Kamal cure rate differential equation. The Kamal model is a first order quasilinear ordinary differential equation, describing the progress of the curing reaction of several...

... epoxy resin. The epoxy∕clay compound is then mixed with EPI-CURE 3282 curing agent by a custom made molding setup and injected into a disk shaped mold cavity. Upon completion of curing, nanoclay dispersion is quantified on a sample cut along the radius of the composite disk. Dispersion of nanoclay...

...L. Chen; J. Cao; Y. J. Weitsman This article concerns the minimization of residual thermal stresses in geometrically constrained adhesive layers and thin polymeric composite lay-ups with emphasis on the role of initial stresses. Such residual stresses evolve during cure and subsequently during post...

... propagation and a contact algorithm to enforce crack closure due to an artificial wedge in the wake of the crack. The healing kinetics of the self-healing material is captured by introducing along the fracture plane a state variable representing the evolving degree of cure of the healing agent. The atomic...

... with monotonic and cyclic loading. The agreement is very good for various loading regimes. The constitutive model is further implemented in a finite element code and the residual stresses arising from the curing process of polymer reinforced composites is determined for two different epoxy resins...

...Brajabandhu Pradhan; Saroja Kanta Panda The present study encompasses the thermoelastic effect of material anisotropy and curing stresses on interlaminar embedded elliptical delamination fracture characteristics in multiply laminated fiber-reinforced polymeric (FRP) composites. Two sets of full...

...Nima Zobeiry; Reza Vaziri; Anoush Poursartip The ability to manufacture thermoset matrix composite materials into large and complex structures can be significantly enhanced by modeling the behavior of the system during the process. As a result there has been much research on all aspects of the cure...

... over the life of the structure. However, these properties may be influenced by the degree of cure of the resin, particularly for room-temperature-cured systems. Thus, this investigation defines the postcure effects on E-glass/vinyl-ester fiber-reinforced polymer (FRP) composites manufactured using...

... resin mixture was finally poured into the inflow hole to fill the vacant space between the aluminum adherends. The assembly was then kept at 120°C for 16 hours to cure the epoxy adhesive layer. 2 Compact tension (CT) specimen of an adhesive joint ( W = 48 mm , a / W ≈ 0.5...