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1-20 of 39
Bahgat G. Sammakia
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Journal Articles
Vahideh Radmard, Ahmad R. Gharaibeh, Mohammad I. Tradat, Cong. H. Hoang, Yaman Yaseen Manaserh, Kourosh Nemati, Scott N. Schiffres, Bahgat G. Sammakia
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021001.
Paper No: EP-22-1003
Published Online: August 8, 2022
Journal Articles
Ahmad R. Gharaibeh, Yaman M. Manaserh, Mohammad I. Tradat, Firas W. AlShatnawi, Scott N. Schiffres, Bahgat G. Sammakia
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031017.
Paper No: EP-21-1164
Published Online: May 19, 2022
Journal Articles
Mohammad I. Tradat, Yaman “Mohammad Ali” Manaserh, Ahmad Gharaibeh, Bahgat G. Sammakia, Dave Hall, Kourosh Nemati, Mark Seymour
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031015.
Paper No: EP-21-1151
Published Online: March 8, 2022
Proceedings Papers
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 747-756, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1089
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031006.
Paper No: EP-17-1110
Published Online: June 11, 2018
Journal Articles
Kourosh Nemati, Husam A. Alissa, Bruce T. Murray, Bahgat G. Sammakia, Russell Tipton, Mark J. Seymour
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. August 2017, 139(8): 082101.
Paper No: HT-16-1281
Published Online: April 11, 2017
Proceedings Papers
Proc. ASME. IMECE2015, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A044, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-51012
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A011, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48069
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A043, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48377
Proceedings Papers
Tianyi Gao, James Geer, Russell Tipton, Bruce Murray, Bahgat G. Sammakia, Alfonso Ortega, Roger Schmidt
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48071
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A009, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48653
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021010.
Paper No: EP-14-1016
Published Online: June 1, 2015
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041004.
Paper No: EP-13-1103
Published Online: September 19, 2014
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. September 2014, 136(3): 030201.
Paper No: EP-14-1067
Published Online: July 24, 2014
Proceedings Papers
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A085, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-65145
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73062
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A015, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73225
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A019, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73216
Proceedings Papers
Bharathkrishnan Muralidharan, Saurabh K. Shrivastava, Mahmoud Ibrahim, Sami A. Alkharabsheh, Bahgat G. Sammakia
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A016, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73201
Proceedings Papers
Sami A. Alkharabsheh, Bharathkrishnan Muralidharan, Mahmoud Ibrahim, Saurabh K. Shrivastava, Bahgat G. Sammakia
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A018, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73214
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