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Proceedings Papers

Development of Phase-Change Materials with Improved Thermal Properties for Space-Related Applications

Patrick Adegbaye, Yong Pei, Mehdi Kabir, Herve Cabrel Sandja Tchamba, Bao Yang, Jiajun Xu

Proc. ASME. IMECE2022, Volume 8: Fluids Engineering; Heat Transfer and Thermal Engineering, V008T11A001, October 30–November 3, 2022

Paper No: IMECE2022-94380

DOI: https://doi.org/10.1115/IMECE2022-94380

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Topics: Phase change materials, Thermal properties

Proceedings Papers

Photonic and Radiative Properties of Bubble Arrays

Koji Miyazaki, Bao Yang, Arvind Narayanaswamy, Gang Chen

Proc. ASME. IMECE2001, Heat Transfer: Volume 1 — Fundamentals of Heat Transfer, 393-396, November 11–16, 2001

Paper No: IMECE2001/HTD-24148

DOI: https://doi.org/10.1115/IMECE2001/HTD-24148

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Topics: Bubbles, Computer simulation, Density, Packing (Shipments), Packings (Cushioning), Reflectance

Journal Articles

Boron-Nitride Nanosheet-Based Thermal Barrier Coating for Micro-Combustor Performance Improvement

Bao Yang, Liangbing Hu, Weiwei Ping, Rishi Roy, Ashwani K. Gupta

J. Energy Resour. Technol. June 2022, 144(6): 062106.

Paper No: JERT-21-1828

DOI: https://doi.org/10.1115/1.4052734

Published Online: October 28, 2021

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Topics: Boron, Combustion, Combustion chambers, Thermal barrier coatings, Temperature, Heat losses, Thermal conductivity, Flames

Journal Articles

Synthesis and Heat Transfer Performance of Phase Change Microcapsule Enhanced Thermal Fluids

Fangyu Cao, Paul Kalinowski, John Lawler, Hak Seung Lee, Bao Yang

J. Heat Transfer. September 2015, 137(9): 091018.

Paper No: HT-14-1263

DOI: https://doi.org/10.1115/1.4030234

Published Online: September 1, 2015

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Topics: Fluids, Heat transfer, Silver, Flow (Dynamics), Thermal conductivity

Proceedings Papers

Experimental Study of Phase-Changeable Water/Polyalphaolefin Nanoemulsion Fluids

Jiajun Xu, B. Hammouda, Fangyu Cao, Bao Yang

Proc. ASME. IMECE2014, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A086, November 14–20, 2014

Paper No: IMECE2014-36533

DOI: https://doi.org/10.1115/IMECE2014-36533

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Topics: Fluids, Water, Heat transfer, Vapors, Cylinders, Heat flux, Heat transfer coefficients, Self-assembly, Shapes, Specific heat

Journal Articles

Synthesis and Characterization of Solid-State Phase Change Material Microcapsules for Thermal Management Applications

Fangyu Cao, Jing Ye, Bao Yang

J. Nanotechnol. Eng. Med. November 2013, 4(4): 040901.

Paper No: NANO-13-1070

DOI: https://doi.org/10.1115/1.4026970

Published Online: March 12, 2014

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Topics: Fluids, Heat capacity, Particulate matter, Phase change materials, Shells, Supercooling, Temperature, Thermal management, Nucleation (Physics), Emulsions

Proceedings Papers

Synthesis and Characterization of Solid State Phase Change Material Microcapsules for Thermal Management Applications

Fangyu Cao, Jing Ye, Bao Yang

Proc. ASME. MNHMT2013, ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer, V001T03A014, December 11–14, 2013

Paper No: MNHMT2013-22254

DOI: https://doi.org/10.1115/MNHMT2013-22254

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Topics: Phase change materials, Thermal management, Shells, Fluids, Heat capacity, Latent heat, Supercooling, Crystals, Emulsions, Heat transfer

Journal Articles

Thermophysical Properties and Pool Boiling Characteristics of Water-in-Polyalphaolefin Nanoemulsion Fluids

Jiajun Xu, Bao Yang, Boualem Hammouda

J. Heat Transfer. September 2013, 135(9): 091303.

Paper No: HT-12-1328

DOI: https://doi.org/10.1115/1.4024423

Published Online: July 26, 2013

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Topics: Fluids, Pool boiling, Water, Viscosity

Proceedings Papers

Thermophysical Properties and Pool Boiling Characteristics of Water in Polyalphaolefin Nanoemulsion Fluids

Jiajun Xu, Bao Yang

Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 321-325, March 3–6, 2012

Paper No: MNHMT2012-75232

DOI: https://doi.org/10.1115/MNHMT2012-75232

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Topics: Fluids, Pool boiling, Water, Thermal conductivity, Boiling, Drops, Maxwell equations, Phase transition temperature, Self-assembly, Sodium

Proceedings Papers

Heat Transfer Performance of a Phase Change Microcapsule Fluid

Paul Kalinowski, John Lawler, Bao Yang, Fangyu Cao

Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 235-243, March 3–6, 2012

Paper No: MNHMT2012-75190

DOI: https://doi.org/10.1115/MNHMT2012-75190

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Topics: Fluids, Heat transfer, Heat transfer coefficients, Particulate matter, Computer cooling, Coolants, Heat sinks, Microchannels, Nanoparticles, Phase change materials

Proceedings Papers

Reactive Heat Source for Standalone Thermoelectric Power Generator: Thermal Analysis of Pyrophoric Iron Mixture

Dale H.-Y. Huang, Thanh N. Tran, Bao Yang

Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 429-433, November 11–17, 2011

Paper No: IMECE2011-63695

DOI: https://doi.org/10.1115/IMECE2011-63695

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Topics: Generators, Heat, Iron, Thermal analysis, Combustion, Activated carbon, Chemical reactions, Differential scanning calorimetry, Fossil fuels, Iron powders

Proceedings Papers

Phase-Change Nanofluids With Enhanced Thermophysical Properties

Zenghu Han, Bao Yang, Yung Y. Liu

Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 1, 441-447, December 18–21, 2009

Paper No: MNHMT2009-18148

DOI: https://doi.org/10.1115/MNHMT2009-18148

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Topics: Heat capacity, Nanofluids, Thermal conductivity

Proceedings Papers

Enhanced Thermoelectric Cooler for On-Chip Hot Spot Cooling

Peng Wang, Avram Bar-Cohen, Bao Yang

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 249-258, July 8–12, 2007

Paper No: IPACK2007-33798

DOI: https://doi.org/10.1115/IPACK2007-33798

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Topics: Contact resistance, Cooling, Thermal management, Thermoelectric coolers

Proceedings Papers

Natural Convective Heat Transfer of Water-in-FC72 Nanoemulsion Fluids

Zenghu Han, Bao Yang

Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 611-614, June 6–9, 2008

Paper No: MNHT2008-52351

DOI: https://doi.org/10.1115/MNHT2008-52351

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Topics: Convection, Fluids, Water, Thermal conductivity, Viscosity, Disperse systems, Nanofluids, Nanoparticles, Particulate matter

Proceedings Papers

Nanofluids Containing Hybrid Sphere/Carbon Nanotube Particles

Zenghu Han, Bao Yang, S. H. Kim, M. R. Zachariah

Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 861-864, January 10–13, 2007

Paper No: MNC2007-21331

DOI: https://doi.org/10.1115/MNC2007-21331

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Topics: Carbon nanotubes, Nanofluids, Particulate matter, Fluids, Nanoparticles, Thermal conductivity, Temperature, Contact resistance, Fibers, Heat

Proceedings Papers

Thermoelectric Micro-Cooler for Hot-Spot Thermal Management

Peng Wang, Avram Bar-Cohen, Bao Yang, Gary L. Solbrekken, Yan Zhang, Ali Shakouri

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2161-2171, July 17–22, 2005

Paper No: IPACK2005-73244

DOI: https://doi.org/10.1115/IPACK2005-73244

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Topics: Cooling, Microcoolers, Thermal management

Journal Articles

Thermal Conductivity Equations Based on Brownian Motion in Suspensions of Nanoparticles (Nanofluids)

Bao Yang

J. Heat Transfer. April 2008, 130(4): 042408.

DOI: https://doi.org/10.1115/1.2789721

Published Online: March 18, 2008

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Topics: Brownian motion, Fluids, Nanofluids, Nanoparticles, Particulate matter, Relaxation (Physics), Thermal conductivity, Water

Proceedings Papers

A New Type of Nanoengineered Heat Transfer Fluids: Nanoemulsion Fluids

Bao Yang, Zenghu Han

Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 333-336, November 5–10, 2006

Paper No: IMECE2006-14031

DOI: https://doi.org/10.1115/IMECE2006-14031

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Topics: Fluids, Heat transfer, Thermal conductivity, Water, Microelectronic devices, Nanoparticles, Optoelectronic devices, Particulate matter, Stability, Thermal management

Proceedings Papers

Analytical Modeling of On-Chip Hotspot Cooling Using Silicon Thermoelectric Microcoolers

Peng Wang, Avram Bar-Cohen, Bao Yang

Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 189-199, November 5–10, 2006

Paper No: IMECE2006-14383

DOI: https://doi.org/10.1115/IMECE2006-14383

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Topics: Cooling, Microcoolers, Modeling, Silicon, Heating, Silicon chips, Joules, Contact resistance, Temperature, Thermal management

Journal citation

NARROW

Development of Phase-Change Materials with Improved Thermal Properties for Space-Related Applications

Photonic and Radiative Properties of Bubble Arrays

Boron-Nitride Nanosheet-Based Thermal Barrier Coating for Micro-Combustor Performance Improvement

Synthesis and Heat Transfer Performance of Phase Change Microcapsule Enhanced Thermal Fluids

Experimental Study of Phase-Changeable Water/Polyalphaolefin Nanoemulsion Fluids

Synthesis and Characterization of Solid-State Phase Change Material Microcapsules for Thermal Management Applications

Synthesis and Characterization of Solid State Phase Change Material Microcapsules for Thermal Management Applications

Thermophysical Properties and Pool Boiling Characteristics of Water-in-Polyalphaolefin Nanoemulsion Fluids

Thermophysical Properties and Pool Boiling Characteristics of Water in Polyalphaolefin Nanoemulsion Fluids

Heat Transfer Performance of a Phase Change Microcapsule Fluid

Reactive Heat Source for Standalone Thermoelectric Power Generator: Thermal Analysis of Pyrophoric Iron Mixture

Phase-Change Nanofluids With Enhanced Thermophysical Properties

Enhanced Thermoelectric Cooler for On-Chip Hot Spot Cooling

Natural Convective Heat Transfer of Water-in-FC72 Nanoemulsion Fluids

Nanofluids Containing Hybrid Sphere/Carbon Nanotube Particles

Thermoelectric Micro-Cooler for Hot-Spot Thermal Management

Thermal Conductivity Equations Based on Brownian Motion in Suspensions of Nanoparticles (Nanofluids)

A New Type of Nanoengineered Heat Transfer Fluids: Nanoemulsion Fluids

Analytical Modeling of On-Chip Hotspot Cooling Using Silicon Thermoelectric Microcoolers

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