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Journal Articles

Some Problems in the Design and Operation of Merchant Vessels

Robert C. Lee
Journal: Journal of Fluids Engineering
Article Type: Research Papers
J. Fluids Eng. February 1940, 62(2): 63–68.
DOI: https://doi.org/10.1115/1.4021339
Published Online: February 10, 2023
View Article titled, Some Problems in the Design and Operation of Merchant Vessels
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Topics: Construction, Design, Economics , Hull, Machine design, Naval architecture, Safety, Sales, Shipbuilding, Ships
Journal Articles

Closure to “Discussions of ‘Some Problems in the Design and Operation of Merchant Vessels’” (1940, Trans. ASME, 62, pp. 68–73)

Robert C. Lee
Journal: Journal of Fluids Engineering
Article Type: Closures
J. Fluids Eng. February 1940, 62(2): 73–74.
DOI: https://doi.org/10.1115/1.4021345
Published Online: February 10, 2023
View Article titled, Closure to “Discussions of ‘Some Problems in the Design and Operation of Merchant Vessels’” (1940, Trans. ASME, 62, pp. 68–73)
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Topics: Design
Journal Articles

A Three-Dimensional Spherical Pitot Probe

J. C. Lee, J. E. Ash
Journal: Journal of Fluids Engineering
Article Type: Research Papers
J. Fluids Eng. April 1956, 78(3): 603–607.
DOI: https://doi.org/10.1115/1.4013746
Published Online: February 21, 2022
View Article titled, A Three-Dimensional Spherical Pitot Probe
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Topics: Probes, Flow (Dynamics), Calibration, Flow measurement, Impellers, Pressure, Yaw
Journal Articles

Closure to “Discussions of ‘A Three-Dimensional Spherical Pitot Probe’” (1956, Trans. ASME, 78, pp. 607–608)

J. C. Lee, J. E. Ash
Journal: Journal of Fluids Engineering
Article Type: Closures
J. Fluids Eng. April 1956, 78(3): 608.
DOI: https://doi.org/10.1115/1.4013750
Published Online: February 21, 2022
View Article titled, Closure to “Discussions of ‘A Three-Dimensional Spherical Pitot Probe’” (1956, Trans. ASME, 78, pp. 607–608)
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Proceedings Papers

A Solid-Fluid Coupling Computing Method for Design High Speed Spindle Cooling System

D. S. Liu, T. C. Lee
Proc. ASME. IMECE98, Recent Advances in Solids and Structures, 215-222, November 15–20, 1998
Paper No: IMECE1998-0903
DOI: https://doi.org/10.1115/IMECE1998-0903
View Paper titled, A Solid-Fluid Coupling Computing Method for Design High Speed Spindle Cooling System
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Topics: Cooling systems, Design, Fluids, Heat, Coolants, Engines, Motors, Pipes, Bearings, Cooling
Proceedings Papers

Three-Dimensional Modeling of Solder Shape for the Design of Solder Self-Assembled Micro-Electro-Mechanical Systems

Paul E. Kladitis, Kevin F. Harsh, Victor M. Bright, Y. C. Lee
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 11-18, November 14–19, 1999
Paper No: IMECE1999-0239
DOI: https://doi.org/10.1115/IMECE1999-0239
View Paper titled, Three-Dimensional Modeling of Solder Shape for the Design of Solder Self-Assembled Micro-Electro-Mechanical Systems
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Topics: Design, Microelectromechanical systems, Self-assembly, Shapes, Solders, Three-dimensional modeling, Surface energy, Modeling, Plates (structures), Surface tension
Proceedings Papers

Solder-Assembled MEMS Flaps to Enhance Fluid Mixing

Zhichun Ma, T. Peacock, E. Bradley, Y. C. Lee
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 731-737, November 11–16, 2001
Paper No: IMECE2001/MEMS-23903
DOI: https://doi.org/10.1115/IMECE2001/MEMS-23903
View Paper titled, Solder-Assembled MEMS Flaps to Enhance Fluid Mixing
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Topics: Fluids, Microelectromechanical systems, Solders, Deflection, Manufacturing, Design, Actuators, Ceramics, Computer simulation, Corners (Structural elements)
Proceedings Papers

Flexible Circuit-Based RF MEMS Switches

Chunjun Wang, Ramesh Ramadoss, Simone Lee, K. C. Gupta, Victor M. Bright, Y. C. Lee
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 757-762, November 11–16, 2001
Paper No: IMECE2001/MEMS-23907
DOI: https://doi.org/10.1115/IMECE2001/MEMS-23907
View Paper titled, Flexible Circuit-Based RF MEMS Switches
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Topics: Circuits, Microelectromechanical systems, Switches, Printed circuit boards
Journal Articles

Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging

H. T. Lee, C. Y. Ho, C. C. Lee
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041001.
Paper No: EP-21-1043
DOI: https://doi.org/10.1115/1.4052075
Published Online: October 6, 2021
View Article titled, Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging
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Topics: Fatigue, Solders, Tin, Displacement, Fracture (Materials), Intermetallic compounds, Packaging, Reliability, Temperature
Proceedings Papers

Stability of Random Difference Systems

W. C. Lee, F. Ma
Proc. ASME. DETC95, Volume 3A: 15th Biennial Conference on Mechanical Vibration and Noise — Vibration of Nonlinear, Random, and Time-Varying Systems, 893-896, September 17–20, 1995
Paper No: DETC1995-0333
DOI: https://doi.org/10.1115/DETC1995-0333
View Paper titled, Stability of Random Difference Systems
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Topics: Stability
Proceedings Papers

Analysis of the Equations of Linear Controlled Structures

F. Ma, W. C. Lee
Proc. ASME. DETC95, Volume 3C: 15th Biennial Conference on Mechanical Vibration and Noise — Vibration Control, Analysis, and Identification, 879-884, September 17–20, 1995
Paper No: DETC1995-0654
DOI: https://doi.org/10.1115/DETC1995-0654
View Paper titled, Analysis of the Equations of Linear Controlled Structures
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Topics: Equations of motion, Modal analysis
Proceedings Papers

Generalization of the Classical Method of Complex Modes

F. Ma, W. C. Lee
Proc. ASME. CIE95, ASME 1995 15th International Computers in Engineering Conference and the ASME 1995 9th Annual Engineering Database Symposium, 255-258, September 17–20, 1995
Paper No: CIE1995-0752
DOI: https://doi.org/10.1115/CIE1995-0752
View Paper titled, Generalization of the Classical Method of Complex Modes
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Topics: Linear systems
Proceedings Papers

Generalization of Classical Modal Analysis

F. Ma, W. C. Lee
Proc. ASME. DETC-CIE96, Volume 6: 16th Computers in Engineering Conference, V006T06A049, August 18–22, 1996
Paper No: 96-DETC/CIE-1622
DOI: https://doi.org/10.1115/96-DETC/CIE-1622
View Paper titled, Generalization of Classical Modal Analysis
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Topics: Modal analysis, Equations of motion
Proceedings Papers

On Simultaneous Triangularization of the Coefficients of Linear Systems

W. C. Lee, F. Ma
Proc. ASME. DETC-CIE96, Volume 6: 16th Computers in Engineering Conference, V006T06A075, August 18–22, 1996
Paper No: 96-DETC/CIE-1626
DOI: https://doi.org/10.1115/96-DETC/CIE-1626
View Paper titled, On Simultaneous Triangularization of the Coefficients of Linear Systems
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Topics: Linear systems
Proceedings Papers

Nonlinear Dynamics and Vibrations of Three Dimensional Multibody Tracked Vehicles

A. A. Shabana, J. H. Choi, H. C. Lee
Proc. ASME. DETC-CIE96, Volume 2B: 24th Biennial Mechanisms Conference, V02BT02A024, August 18–22, 1996
Paper No: 96-DETC/MECH-1186
DOI: https://doi.org/10.1115/96-DETC/MECH-1186
View Paper titled, Nonlinear Dynamics and Vibrations of Three Dimensional Multibody Tracked Vehicles
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Topics: Nonlinear dynamics, Tracked vehicles, Vibration, Vehicles, Algebra, Chain, Closed kinematic chains, Computer simulation, Degrees of freedom, Dynamic analysis
Proceedings Papers

Simplification of the Equations of Nonlinear Vibrations

W. C. Lee, F. Ma
Proc. ASME. DETC97, Volume 5: 17th Computers in Engineering Conference, V005T32A053, September 14–17, 1997
Paper No: DETC97/CIE-4449
DOI: https://doi.org/10.1115/DETC97/CIE-4449
View Paper titled, Simplification of the Equations of Nonlinear Vibrations
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Topics: Vibration
Journal Articles

A Review on United States Patents to Prevent Mechanical Failures in Foldable Smartphones

Ali Nematollahisarvestani, Yung-Cheng “Y. C.” Lee
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020802.
Paper No: EP-20-1043
DOI: https://doi.org/10.1115/1.4048011
Published Online: September 3, 2020
View Article titled, A Review on United States Patents to Prevent Mechanical Failures in Foldable Smartphones
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Topics: Buckling, Deformation, Delamination, Failure, Fracture (Materials), Fracture (Process), Patents, Stress, Coatings
Journal Articles

Characterization of Hybrid Wicking Structures for Flexible Vapor Chambers

Dylan P. McNally, Ryan Lewis, Y. C. Lee
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2019, 141(1): 011005.
Paper No: EP-18-1064
DOI: https://doi.org/10.1115/1.4042255
Published Online: February 25, 2019
View Article titled, Characterization of Hybrid Wicking Structures for Flexible Vapor Chambers
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Topics: Columns (Structural), Flow (Dynamics), Permeability, Pressure, Vapors, Testing, Copper, Water
Proceedings Papers

Characterization of Long Period Grating With a Screw Shape Fabricated by a Single-Path Scanning of Femtosecond Laser

Hang-Eun Joe, Huitaek Yun, Martin B. G. Jun, Yonghyun Cho, Farid Ahmed, Patrick C. Lee
Proc. ASME. MSEC2018, Volume 4: Processes, V004T03A013, June 18–22, 2018
Paper No: MSEC2018-6556
DOI: https://doi.org/10.1115/MSEC2018-6556
View Paper titled, Characterization of Long Period Grating With a Screw Shape Fabricated by a Single-Path Scanning of Femtosecond Laser
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Topics: Diffraction gratings, Lasers, Screws, Shapes, Manufacturing, Sensors, Fibers, Irradiation (Radiation exposure), Optical fiber
Journal Articles

Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology

Li-Anne Liew, Ching-Yi Lin, Ryan Lewis, Susan Song, Qian Li, Ronggui Yang, Y. C. Lee
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011003.
Paper No: EP-16-1103
DOI: https://doi.org/10.1115/1.4035241
Published Online: December 7, 2016
View Article titled, Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology
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Topics: Copper, Heat, Manufacturing, Printed circuit boards, Vapors, Water, Nylon fabrics, Condensers (steam plant), Thermal resistance