Search Results | ASME Digital Collection

1-10 of 10

Sort by

Sort Order Select

Proceedings Papers

Micro Protein Arrays Prepared by Microfabricated Stamps

F. G. Tseng, H. M. Huang, C. S. Liu, C. Y. Huang, S. C. Lin, C. C. Chieng

Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 659-665, November 5–10, 2000

Paper No: IMECE2000-1160

DOI: https://doi.org/10.1115/IMECE2000-1160

View Paper

Topics: Microfabrication, Proteins, Aluminum, Metal stamping, Absorption, Biological tissues, Coating processes, Coatings, Manufacturing, Micromachining

Proceedings Papers

Influence of Rotating Directions on Hydro-Thermal Characteristics of a Two-Pass Parallelogram Channel With Detached Transverse Ribs

T. M. Liou, C. Y. Huang, I. A. Lan, S. P. Chan, S. W. Chang

Proc. ASME. GT2018, Volume 5A: Heat Transfer, V05AT11A002, June 11–15, 2018

Paper No: GT2018-75278

DOI: https://doi.org/10.1115/GT2018-75278

View Paper

Topics: Buoyancy, Coriolis force, Density, Flow (Dynamics), Friction, Heat transfer, Reynolds number

Proceedings Papers

Mode Coupling Behavior in End Milling

C. Y. Huang, J.-J. Junz Wang

Proc. ASME. IMECE2009, Volume 10: Mechanical Systems and Control, Parts A and B, 875-884, November 13–19, 2009

Paper No: IMECE2009-10861

DOI: https://doi.org/10.1115/IMECE2009-10861

View Paper

Topics: Chatter, Milling

Proceedings Papers

An Approach to Determining Residual Strains and Moisture Diffusion Coefficients of Cured Adhesives in Electronic Packaging

M. Y. Tsai, C. Y. Huang, C. Y. Chiang, C. Y. Wu, S. S. Yang

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 711-717, July 8–12, 2007

Paper No: IPACK2007-33967

DOI: https://doi.org/10.1115/IPACK2007-33967

View Paper

Topics: Adhesives, Diffusion (Physics), Electronic packaging, Temperature, Shrinkage (Materials), Stress, Finite element methods, Relaxation (Physics), Design, Hardening (Curing)

Journal Articles

Strain-Dependent Oxygen Diffusivity in Bovine Annulus Fibrosus

T.-Y. Yuan, A. R. Jackson, C.-Y. Huang, W. Y. Gu

J Biomech Eng. July 2009, 131(7): 074503.

DOI: https://doi.org/10.1115/1.3127254

Published Online: June 4, 2009

View Article

Topics: Compression, Oxygen, Annulus, Biological tissues, Diffusion (Physics), Intervertebral discs

Proceedings Papers

The Effect of Harmonic Force Components on Regenerative Stability in End Milling

J.-J. Junz Wang, C. M. Zheng, C. Y. Huang

Proc. ASME. IMECE2003, Manufacturing, 103-112, November 15–21, 2003

Paper No: IMECE2003-42367

DOI: https://doi.org/10.1115/IMECE2003-42367

View Paper

Topics: Cutting, Milling, Stability

Proceedings Papers

A Pole/Zero Placement Approach to Reducing Structure Vibration in End Milling

J.-J. Junz Wang, C. Y. Huang

Proc. ASME. IMECE2003, Manufacturing, 515-521, November 15–21, 2003

Paper No: IMECE2003-42368

DOI: https://doi.org/10.1115/IMECE2003-42368

View Paper

Topics: Cutting, Milling, Poles (Building), Vibration

Proceedings Papers

Mechanistic Modeling of Process Damping in Peripheral Milling

C. Y. Huang, J.-J. Junz Wang

Proc. ASME. IMECE2005, Manufacturing Engineering and Materials Handling, Parts A and B, 397-406, November 5–11, 2005

Paper No: IMECE2005-80880

DOI: https://doi.org/10.1115/IMECE2005-80880

View Paper

Topics: Damping, Die cutting, Milling, Modeling, Shearing (Deformation), Vibration

Proceedings Papers

Study on Copper Cold Plate Designs for Electronics Liquid Cooling System

Yi. Feng, Y. Wang, C. Y. Huang

Proc. ASME. IMECE2006, Heat Transfer, Volume 1, 759-766, November 5–10, 2006

Paper No: IMECE2006-16242

DOI: https://doi.org/10.1115/IMECE2006-16242

View Paper

Topics: Cooling systems, Copper, Electronics, Cooling, Design, Heat exchangers, Heat transfer, Plates (structures), Pumps, Brazing

Journal Articles

Mechanistic Modeling of Process Damping in Peripheral Milling

C. Y. Huang, J. J. Junz Wang

J. Manuf. Sci. Eng. February 2007, 129(1): 12–20.

DOI: https://doi.org/10.1115/1.2335857

Published Online: March 22, 2006

View Article

Topics: Cutting, Damping, Milling, Vibration, Die cutting, Shearing (Deformation)

Journal citation

NARROW

Micro Protein Arrays Prepared by Microfabricated Stamps

Influence of Rotating Directions on Hydro-Thermal Characteristics of a Two-Pass Parallelogram Channel With Detached Transverse Ribs

Mode Coupling Behavior in End Milling

An Approach to Determining Residual Strains and Moisture Diffusion Coefficients of Cured Adhesives in Electronic Packaging

Strain-Dependent Oxygen Diffusivity in Bovine Annulus Fibrosus

The Effect of Harmonic Force Components on Regenerative Stability in End Milling

A Pole/Zero Placement Approach to Reducing Structure Vibration in End Milling

Mechanistic Modeling of Process Damping in Peripheral Milling

Study on Copper Cold Plate Designs for Electronics Liquid Cooling System

Mechanistic Modeling of Process Damping in Peripheral Milling

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only