1-2 of 2
J. Laskar
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies

J.-H. Lee, S. Sarkar, S. Pinel, J. Papapolymerou, J. Laskar, M. M. Tentzeris
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1607-1611, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73127
https://doi.org/10.1115/IPACK2005-73127
View Paper titled, 3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies
Open the PDF for 3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies in another window
Topics: Millimeter waves, Design, Ceramics, Filters, Dimensions, Electromagnetic spectrum, Filtration, Internet, Liquid crystalline polymers, Low temperature
Proceedings Papers

RF System-on-Package (SOP) Development for Compact Low Cost Wireless Front-End Systems

M. Tentzeris, J. Laskar
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 19-24, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35360
https://doi.org/10.1115/IPACK2003-35360
View Paper titled, RF System-on-Package (SOP) Development for Compact Low Cost Wireless Front-End Systems
Open the PDF for RF System-on-Package (SOP) Development for Compact Low Cost Wireless Front-End Systems in another window
Topics: Architecture, Cavities, Filters, Finite difference time-domain analysis, Inductors, Manufacturing, Microelectromechanical systems, Modeling, Q-factor, Simulation