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Jackson B. Marcinichen
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Journal Articles

Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter

Enzo M. Minazzo, Gautier Rouaze, Jackson B. Marcinichen, John R. Thome, Fred Buining
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041105.
Paper No: EP-24-1033
https://doi.org/10.1115/1.4065863
Published Online: July 25, 2024
View Article titled, Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter
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Topics: Condensers (steam plant), Cooling systems, Fluids, Heat, Secondary cells, Stress, Temperature, Thermal resistance, Pipeline risers, Risers (Casting)
Proceedings Papers

Thermal-Hydraulic Characterization of Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter. Part II: Solver Validation

Enzo M. Minazzo, Gautier Rouaze, Jackson B. Marcinichen, John R. Thome, Fred Buining
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111848
https://doi.org/10.1115/IPACK2023-111848
View Paper titled, Thermal-Hydraulic Characterization of Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter. Part II: Solver Validation
Open the PDF for Thermal-Hydraulic Characterization of Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter. Part II: Solver Validation in another window
Topics: Cooling systems
Proceedings Papers

Thermal-Hydraulic Characterization of Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter. Part I: Design and Experiments

Gautier Rouaze, Enzo M. Minazzo, Jackson B. Marcinichen, John R. Thome, Fred Buining
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111837
https://doi.org/10.1115/IPACK2023-111837
View Paper titled, Thermal-Hydraulic Characterization of Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter. Part I: Design and Experiments
Open the PDF for Thermal-Hydraulic Characterization of Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter. Part I: Design and Experiments in another window
Topics: Cooling systems, Design, Refrigerants
Proceedings Papers

Compact and Highly Thermal-Hydraulic Efficient Air-Cooled Closed Loop Thermosyphon Cooling System for High Intense Heat Load Dissipation of Future Microprocessors

Enzo M. Minazzo, Gautier Rouaze, Jackson B. Marcinichen, John R. Thome, L. Winston Zhang
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97364
https://doi.org/10.1115/IPACK2022-97364
View Paper titled, Compact and Highly Thermal-Hydraulic Efficient Air-Cooled Closed Loop Thermosyphon Cooling System for High Intense Heat Load Dissipation of Future Microprocessors
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Topics: Cooling systems, Energy dissipation, Heat, Stress
Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021110.
Paper No: EP-21-1048
https://doi.org/10.1115/1.4052767
Published Online: November 22, 2021
View Article titled, Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
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Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities
Proceedings Papers

Compact Thermosyphon Cooling System For High Heat Flux Servers: Validation Of Thermosyphon Simulation Code Considering New Test Data

Rémy Haynau, Jackson B. Marcinichen, Raffaele L. Amalfi, Filippo Cataldo, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72620
https://doi.org/10.1115/IPACK2021-72620
View Paper titled, Compact Thermosyphon Cooling System For High Heat Flux Servers: Validation Of Thermosyphon Simulation Code Considering New Test Data
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Topics: Cooling systems, Heat flux, Simulation
Proceedings Papers

Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers

Filippo Cataldo, Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72621
https://doi.org/10.1115/IPACK2021-72621
View Paper titled, Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers
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Topics: Computer cooling, Computers, Cooling systems, Cooling, Energy consumption, Climate change, Condensers (steam plant), Flow (Dynamics), Fluids, Heat
Proceedings Papers

Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers

Raffaele L. Amalfi, Cong H. Hoang, Ryan Enright, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72612
https://doi.org/10.1115/IPACK2021-72612
View Paper titled, Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers
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Topics: Cooling systems, Cooling, Heat, Heat flux, Computer cooling, Containment systems, Coolants, Copper, Density, Design
Proceedings Papers

Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters

Jackson B. Marcinichen, John R. Thome, Raffaele L. Amalfi, Filippo Cataldo
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2541
https://doi.org/10.1115/IPACK2020-2541
View Paper titled, Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters
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Topics: Cooling systems, Design, Engineering simulation, Simulation, Cooling, Flow (Dynamics), Heat, Architecture, Boiling, Computer cooling
Proceedings Papers

Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2542
https://doi.org/10.1115/IPACK2020-2542
View Paper titled, Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters
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Topics: Heat exchangers, Microscale devices, Thermal management, Cooling, Heat, Pressure drop, Density, Flow (Dynamics), Heat transfer, Refrigerants
Proceedings Papers

Design of Passive Two-Phase Thermosyphons for Server Cooling

Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome, Filippo Cataldo
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6386
https://doi.org/10.1115/IPACK2019-6386
View Paper titled, Design of Passive Two-Phase Thermosyphons for Server Cooling
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Topics: Cooling, Design, Energy consumption, Heat, Cooling systems, Artificial intelligence, Condensers (steam plant), Coolants, Databases, Electric vehicles
Journal Articles

Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis

Nicolas Lamaison, Raffaele L. Amalfi, Todd Salamon, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010901.
Paper No: EP-17-1085
https://doi.org/10.1115/1.4039091
Published Online: March 2, 2018
View Article titled, Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis
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Topics: Condensers (steam plant), Flow (Dynamics), Heat, Secondary cells, Stress, Temperature, Subcooling, Cooling systems, Refrigerants, Electronics
Proceedings Papers

Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis

Nicolas Lamaison, Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome, Todd Salamon
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74020
https://doi.org/10.1115/IPACK2017-74020
View Paper titled, Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis
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Topics: Cooling systems, Electronics, Experimental analysis, Secondary cells, Boiling, Computer cooling, Condensers (steam plant), Cooling, Cylinders, Electronic components
Proceedings Papers

Two-Phase Mini-Thermosyphon for Cooling of Datacenters: Experiments, Modeling and Simulations

Chin L. Ong, Raffaele L. Amalfi, Jackson B. Marcinichen, Nicolas Lamaison, John R. Thome
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74030
https://doi.org/10.1115/IPACK2017-74030
View Paper titled, Two-Phase Mini-Thermosyphon for Cooling of Datacenters: Experiments, Modeling and Simulations
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Topics: Cooling, Modeling, Simulation, Heat, Density, Energy dissipation, Flow (Dynamics), Temperature, Water, Acoustics
Proceedings Papers

Passive Thermosyphon Cooling System for High Heat Flux Servers

Sylwia Szczukiewicz, Nicolas Lamaison, Jackson B. Marcinichen, John R. Thome, Peter J. Beucher
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A009, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48288
https://doi.org/10.1115/IPACK2015-48288
View Paper titled, Passive Thermosyphon Cooling System for High Heat Flux Servers
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Topics: Cooling systems, Heat flux, Cooling, Critical heat flux, Design, Condensers (steam plant), Fluids, Heat, Heat exchangers, Pipeline risers
Proceedings Papers

3D Stacks of Microprocessors and Memories With Backside Two-Phase Multi-Microchannel Cooler

Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A020, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73263
https://doi.org/10.1115/IPACK2013-73263
View Paper titled, 3D Stacks of Microprocessors and Memories With Backside Two-Phase Multi-Microchannel Cooler
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Topics: Microchannels, Cooling, Manufacturing, Thermohydrodynamics, Architecture, Computers, Density, Design, Electronic components, Engineering simulation
Proceedings Papers

Dynamic Modeling of a Two-Phase On-Chip Cooling System Applied on Parallel High Performance Microprocessors

Nicolas Lamaison, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A021, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73264
https://doi.org/10.1115/IPACK2013-73264
View Paper titled, Dynamic Modeling of a Two-Phase On-Chip Cooling System Applied on Parallel High Performance Microprocessors
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Topics: Cooling systems, Dynamic modeling, Heat, Critical heat flux, Flow (Dynamics), Temperature, Transients (Dynamics), Condensers (steam plant), Pumps, Simulation
Proceedings Papers

Thermal Management of Ultra Intense Hot Spots With Two-Phase Multi-Microchannels and Embedded Thermoelectric Cooling

Jackson B. Marcinichen, Brian P. d’Entremont, John R. Thome, Gary Bulman, Jay Lewis, Rama Venkatasubramanian
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A023, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73276
https://doi.org/10.1115/IPACK2013-73276
View Paper titled, Thermal Management of Ultra Intense Hot Spots With Two-Phase Multi-Microchannels and Embedded Thermoelectric Cooling
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Topics: Microchannels, Thermal management, Thermoelectric cooling, Cooling, Thermoelectric coolers, Heat, Computer simulation, Currents, Design, Electric current
Journal Articles

Green Cooling of High Performance Microprocessors: Parametric Study Between Flow Boiling and Water Cooling

Jonathan A. Olivier, Jackson B. Marcinichen, Arnaud Bruch, John Thome
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2011, 3(4): 041003.
https://doi.org/10.1115/1.4004435
Published Online: October 24, 2011
View Article titled, Green Cooling of High Performance Microprocessors: Parametric Study Between Flow Boiling and Water Cooling
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Topics: Cooling, Flow (Dynamics), Fluids, Heat, Heat flux, Refrigerants, Temperature, Water, Exergy, Flux (Metallurgy)