1-4 of 4
Kayleen L. E. Helms
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Observation and Prediction of Damage Evolution in Continuous Fiber Titanium Matrix Composites

David H. Allen, James W. Foulk, III, Kayleen L. E. Helms
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 109-116, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0655
https://doi.org/10.1115/IMECE1997-0655
View Paper titled, Observation and Prediction of Damage Evolution in Continuous Fiber Titanium Matrix Composites
Open the PDF for Observation and Prediction of Damage Evolution in Continuous Fiber Titanium Matrix Composites in another window
Topics: Composite materials, Damage, Fibers, Titanium, Embrittlement, Failure, Crack propagation, Cracking (Materials), Fatigue, Fracture (Process)
Proceedings Papers

The Characterization of Damage Propagation of BGA Flip-Chip Electronic Packages Under Mechanical Shock Loading

Kayleen L. E. Helms, Ketan R. Shah, Dan Gerbus, Vasu S. Vasudevan, Jagadeesh Radhakrishnan, Will Berry
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 945-951, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89347
https://doi.org/10.1115/InterPACK2009-89347
View Paper titled, The Characterization of Damage Propagation of BGA Flip-Chip Electronic Packages Under Mechanical Shock Loading
Open the PDF for The Characterization of Damage Propagation of BGA Flip-Chip Electronic Packages Under Mechanical Shock Loading in another window
Topics: Ball-Grid-Array packaging, Damage, Electronic packages, Flip-chip, Shock (Mechanics), Design, Risk, Solder joints, Accelerated life testing, Alloys
Proceedings Papers

The Impact of Varying Feature Dimensions on Substrate Reliability Risks

Kayleen L. E. Helms, Qing A. Zhou, Charles Zhang
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1557-1563, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73428
https://doi.org/10.1115/IPACK2005-73428
View Paper titled, The Impact of Varying Feature Dimensions on Substrate Reliability Risks
Open the PDF for The Impact of Varying Feature Dimensions on Substrate Reliability Risks in another window
Topics: Dimensions, Reliability, Modeling, Design, Geometry, Cracking (Materials), Electronic packaging, Failure, Failure mechanisms, Finite element analysis
Proceedings Papers

The Characterization of Damage Propagation in BGA’s on Flip-Chip Electronic Packages

Kayleen L. E. Helms, Betty Phillips
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1565-1573, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73429
https://doi.org/10.1115/IPACK2005-73429
View Paper titled, The Characterization of Damage Propagation in BGA’s on Flip-Chip Electronic Packages
Open the PDF for The Characterization of Damage Propagation in BGA’s on Flip-Chip Electronic Packages in another window
Topics: Damage, Electronic packages, Flip-chip, Solder joints, Ball-Grid-Array packaging, Failure analysis, Fracture (Materials), Cracking (Materials), Design, Flat heat pipes