1-4 of 4
Kenya Kawano
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Reliability of Underfill-Encapsulated Flip-Chip Packages

Hiroaki Doi, Kenya Kawano, Akio Yasukawa, Toshihiko Sato
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 7-14, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0494
https://doi.org/10.1115/IMECE1997-0494
View Paper titled, Reliability of Underfill-Encapsulated Flip-Chip Packages
Open the PDF for Reliability of Underfill-Encapsulated Flip-Chip Packages in another window
Topics: Flip-chip packages, Reliability, Flat heat pipes, Solder joints, Delamination, Mechanical properties, Shapes, Stress, Stress analysis (Engineering), Finite element methods
Proceedings Papers

Strength Evaluation of Conductive Adhesive Paste for Die Bonding During Reflow Soldering

Kisho Ashida, Kenya Kawano, Naotaka Tanaka, Atsushi Nishikizawa, Nobuya Koike
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 825-831, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89273
https://doi.org/10.1115/InterPACK2009-89273
View Paper titled, Strength Evaluation of Conductive Adhesive Paste for Die Bonding During Reflow Soldering
Open the PDF for Strength Evaluation of Conductive Adhesive Paste for Die Bonding During Reflow Soldering in another window
Topics: Adhesives, Bonding, Reflow soldering, Silver, Fracture (Process), Fracture toughness, Copper, Failure, Resins, Stress
Proceedings Papers

Development of New Power MOSFETs Package With Double-Sided Cooling

Kisho Ashida, Akira Muto, Ichio Shimizu, Kenya Kawano, Naotaka Tanaka, Nae Yoneda
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 423-427, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33023
https://doi.org/10.1115/IPACK2007-33023
View Paper titled, Development of New Power MOSFETs Package With Double-Sided Cooling
Open the PDF for Development of New Power MOSFETs Package With Double-Sided Cooling in another window
Topics: Cooling, Solders, Fracture (Materials), Thermal resistance, Copper, Fatigue, Fatigue life, Packaging, Structural optimization, Crack propagation
Journal Articles

A Highly Reliable Design for a Nonmetallurgical Contact-Joint Structure Consisting of an Adhesive Film

Naotaka Tanaka, Senior Researcher, Kenya Kawano, Researcher, Hideo Miura, Chief Researcher, Yoshiyuki Kado, Engineer, Ikuo Yoshida, Senior Engineer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 82–86.
https://doi.org/10.1115/1.1648059
Published Online: April 30, 2004
View Articletitled, A Highly Reliable Design for a Nonmetallurgical Contact-Joint Structure Consisting of an Adhesive Film
Open the PDF for A Highly Reliable Design for a Nonmetallurgical Contact-Joint Structure Consisting of an Adhesive Film in another window
Topics: Adhesives, Deformation, Relaxation (Physics), Reliability, Stress, Temperature, Design, Glass transition, Elasticity