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Proceedings Papers

Application of the Thermal Network Method to the Transient Thermal Analysis of Multichip Modules

Masaru Ishizuka, Hideo Iwasaki

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 75-81, November 16–21, 1997

Paper No: IMECE1997-1216

DOI: https://doi.org/10.1115/IMECE1997-1216

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Topics: Multi-chip modules, Thermal analysis, Transients (Dynamics), Density, Design, Electronic circuits, Energy dissipation, Heat, Packaging, Reliability

Proceedings Papers

Micro Channel Heat Exchanger for Cooling Electrical Equipment

Koichiro Kawano, Ko Minakami, Hideo Iwasaki, Masaru Ishizuka

Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 173-180, November 15–20, 1998

Paper No: IMECE1998-0650

DOI: https://doi.org/10.1115/IMECE1998-0650

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Topics: Cooling, Electrical components, Heat exchangers, Microchannels, Pressure, Heat, Heat transfer, Computer simulation, Design, Integrated circuits

Proceedings Papers

Thermal Analysis of Stacked Ni-MH Battery

Katsumi Hisano, Hideo Iwasaki, Masaru Ishizuka, Tetsuya Yamane

Proc. ASME. IMECE99, Heat Transfer: Volume 1, 333-337, November 14–19, 1999

Paper No: IMECE1999-1001

DOI: https://doi.org/10.1115/IMECE1999-1001

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Topics: Nickel metal hydride batteries, Thermal analysis, Stress, Pallets, Temperature, Batteries, Numerical analysis, Transportation systems

Proceedings Papers

CFD - Based Investigation of Effects of Obstruction in Front of Small Axial Cooling Fan and Deterioration of Supply Flow Rate

Tetsushi Fukuda, Yukio Masuda, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka, Katsuhiro Koizumi

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 26–28, 2021

Paper No: IPACK2021-72976

DOI: https://doi.org/10.1115/IPACK2021-72976

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Topics: Computational fluid dynamics, Cooling, Flow (Dynamics), Impellers, Density, Electronic equipment, Packaging, Fans, Flow visualization, Pressure

Proceedings Papers

Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure

Masaya Fukada, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 26–28, 2021

Paper No: IPACK2021-72975

DOI: https://doi.org/10.1115/IPACK2021-72975

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Topics: Flow (Dynamics), Heat sinks, Modeling, Thermal resistance, Electronic equipment, Cooling, Design, Forced convection, Heat transfer, Network analysis

Proceedings Papers

Studies on Natural Convection Induced Flow and Thermal Behavior Inside Electronic Equipment Cabinet Model

Masaru Ishizuka, Guoyi Peng, Shinji Hayama

Proc. ASME. IMECE2001, Heat Transfer: Volume 5 — Computational, Aerospace and Environmental Heat Transfer, 171-176, November 11–16, 2001

Paper No: IMECE2001/HTD-24299

DOI: https://doi.org/10.1115/IMECE2001/HTD-24299

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Topics: Electronic equipment, Flow (Dynamics), Heat flux, Natural convection

Proceedings Papers

On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)

Toshio Tomimura, Yasushi Koito, Taewan Do, Masaru Ishizuka, Tomoyuki Hatakeyama

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A073, July 6–9, 2015

Paper No: IPACK2015-48302

DOI: https://doi.org/10.1115/IPACK2015-48302

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Topics: Contact resistance, Pressure, Heat, Surface roughness, Temperature, Bearings, Control systems, Electronic equipment, Errors, Satellites

Proceedings Papers

Flow Resistance Network Analysis in Fan-Cooled High-Density Packaging Electronic Equipment

Takashi Fukue, Tomoyuki Hatakeyama, Masaru Ishizuka, Koichi Hirose, Kazuma Obata, Katsuhiro Koizumi

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A044, July 6–9, 2015

Paper No: IPACK2015-48600

DOI: https://doi.org/10.1115/IPACK2015-48600

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Topics: Density, Electronic equipment, Flow (Dynamics), Network analysis, Packaging, Air flow, Computational fluid dynamics, Cooling, Design, Diluents

Proceedings Papers

A Parametric Study of the Impact of Energy Relaxation Time on Thermal Behavior of Power Si MOSFET in Electro-Thermal Analysis

Risako Kibushi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A061, July 6–9, 2015

Paper No: IPACK2015-48802

DOI: https://doi.org/10.1115/IPACK2015-48802

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Topics: MOSFET transistors, Relaxation (Physics), Temperature distribution, Simulation, Electric fields, Thermal properties, Heat, Physics, Temperature

Proceedings Papers

Microprocessor Silicon Die Temperature Prediction by Simplified Boundary Conditions

Koji Nishi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A082, July 6–9, 2015

Paper No: IPACK2015-48205

DOI: https://doi.org/10.1115/IPACK2015-48205

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Topics: Boundary-value problems, Silicon, Temperature, Thermal resistance, Computation, Heat conduction, Heat transfer, Simulation results, Design, Electronic equipment

Proceedings Papers

Numerical Analysis of Two-Dimensional Compressible Viscous Flow in Turbomachinery Cascades Using an Improved k-ε Turbulence Model

Debasish Biswas, Hideo Iwasaki, Masaru Ishizuka

Proc. ASME. GT1997, Volume 1: Aircraft Engine; Marine; Turbomachinery; Microturbines and Small Turbomachinery, V001T03A070, June 2–5, 1997

Paper No: 97-GT-417

DOI: https://doi.org/10.1115/97-GT-417

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Topics: Numerical analysis, Turbomachinery, Turbulence, Viscous flow, Shock (Mechanics), Blades, Flow (Dynamics), Reynolds number, Boundary layers, Compressors

Proceedings Papers

Steady and Transient Heat Transfer Analysis of the Microprocessor System Using One-Dimensional Thermal Network

Koji Nishi, Tomoyuki Hatakeyama, Masaru Ishizuka

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A009, July 16–18, 2013

Paper No: IPACK2013-73052

DOI: https://doi.org/10.1115/IPACK2013-73052

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Topics: Cooling, Heat, Heat conduction, Heat sinks, Silicon, Simulation, Steady state, Temperature, Thermal resistance, Transient heat transfer

Proceedings Papers

Estimation of Heat Generation From Power Si MOSFET Using Electro-Thermal Analysis

Risako Kibushi, Tomoyuki Hatakeyama, Masaru Ishizuka

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A049, July 16–18, 2013

Paper No: IPACK2013-73273

DOI: https://doi.org/10.1115/IPACK2013-73273

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Topics: Heat, MOSFET transistors, Electrons, Temperature, Thermal energy, Thermal properties, Crystal lattices, Density, Electric fields, Electronics

Proceedings Papers

Relationships Between Supply Flow Rate of Small Cooling Fans and Pressure Drop Characteristics in Electronic Enclosure

Takashi Fukue, Tomoyuki Hatakeyama, Masaru Ishizuka, Koichi Hirose, Katsuhiro Koizumi

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A020, July 16–18, 2013

Paper No: IPACK2013-73089

DOI: https://doi.org/10.1115/IPACK2013-73089

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Topics: Cooling, Fans, Flow (Dynamics), Pressure drop, Density, Packaging, Pressure, Design, Electronic equipment

Proceedings Papers

Estimation of Heat Generation From Power Si MOSFET Using Electro-Thermal Analysis

Risako Kibushi, Tomoyuki Hatakeyama, Masaru Ishizuka

Proc. ASME. ICNMM2013, ASME 2013 11th International Conference on Nanochannels, Microchannels, and Minichannels, V001T05A005, June 16–19, 2013

Paper No: ICNMM2013-73169

DOI: https://doi.org/10.1115/ICNMM2013-73169

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Topics: Heat, MOSFET transistors, Electrical properties, Electrons, Thermal energy, Crystal lattices, Electric fields, Electronics, Energy levels (Quantum mechanics), Temperature

Proceedings Papers

Comparison Between PIV Results and CFD Simulations of Air Flows in a Thin Electronics Casing Model

Masaru Ishizuka, Tomoyuki Hatakeyama, Risako Kibushi, Yasushi Nishino, Shinji Nakagawa

Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 1405-1410, November 9–15, 2012

Paper No: IMECE2012-85581

DOI: https://doi.org/10.1115/IMECE2012-85581

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Topics: Air flow, Computational fluid dynamics, Electronics, Engineering simulation, Simulation, Electronic equipment, Flow (Dynamics), Cooling, Heat, Particulate matter

Proceedings Papers

Study on P-Q Curves of Cooling Fans for Thermal Design of Electronic Equipment (Effects of Opening Position of Obstructions Near a Fan)

Takashi Fukue, Masaru Ishizuka, Tomoyuki Hatakeyama, Shinji Nakagawa, Katsuhiro Koizumi

Proc. ASME. AJK2011, ASME-JSME-KSME 2011 Joint Fluids Engineering Conference: Volume 1, Symposia – Parts A, B, C, and D, 737-745, July 24–29, 2011

Paper No: AJK2011-22054

DOI: https://doi.org/10.1115/AJK2011-22054

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Topics: Cooling, Design, Electronic equipment, Fans, Flow (Dynamics), Pressure, Density, Capacitors, Electronic components, Heat sinks

Proceedings Papers

Optimization of Natural Air Cooling in a Vertical Channel of Electronic Equipment

Yasushi Nishino, Masaru Ishizuka, Tomoyuki Hatakeyama, Shinji Nakagawa

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 145-153, November 12–18, 2010

Paper No: IMECE2010-37028

DOI: https://doi.org/10.1115/IMECE2010-37028

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Topics: Cooling, Electronic equipment, Optimization, Clearances (Engineering), Copper, Computer simulation, Temperature, Air flow, Ducts, Natural convection

Proceedings Papers

Thermal Resistance Measurement and Thermal Network Analysis of Printed Circuit Board With Thermal Vias

Tomoyuki Hatakeyama, Masaru Ishizuka, Shinji Nakagawa, Sadakazu Takakuwa

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 251-258, July 6–8, 2011

Paper No: IPACK2011-52168

DOI: https://doi.org/10.1115/IPACK2011-52168

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Topics: Network analysis, Printed circuit boards, Thermal resistance, Copper, Heat, Computational fluid dynamics, Temperature, Electronics, Epoxy adhesives, Epoxy resins

Proceedings Papers

Investigation of Effect of Wiring Patterns on In-Plane Thermal Conductivity of Printed Circuit Boards

Yuta Nakano, Tomoyuki Hatakeyama, Masaru Ishizuka, Shinji Nakagawa, Masataka Hirokawa, Toshio Tomimura

Paper No: IPACK2011-52106

DOI: https://doi.org/10.1115/IPACK2011-52106

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Topics: Electrical wires, Printed circuit boards, Thermal conductivity, Copper, Wire, Computational fluid dynamics, Thermal diffusion

Journal citation

NARROW

Application of the Thermal Network Method to the Transient Thermal Analysis of Multichip Modules

Micro Channel Heat Exchanger for Cooling Electrical Equipment

Thermal Analysis of Stacked Ni-MH Battery

CFD - Based Investigation of Effects of Obstruction in Front of Small Axial Cooling Fan and Deterioration of Supply Flow Rate

Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure

Studies on Natural Convection Induced Flow and Thermal Behavior Inside Electronic Equipment Cabinet Model

On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)

Flow Resistance Network Analysis in Fan-Cooled High-Density Packaging Electronic Equipment

A Parametric Study of the Impact of Energy Relaxation Time on Thermal Behavior of Power Si MOSFET in Electro-Thermal Analysis

Microprocessor Silicon Die Temperature Prediction by Simplified Boundary Conditions

Numerical Analysis of Two-Dimensional Compressible Viscous Flow in Turbomachinery Cascades Using an Improved k-ε Turbulence Model

Steady and Transient Heat Transfer Analysis of the Microprocessor System Using One-Dimensional Thermal Network

Estimation of Heat Generation From Power Si MOSFET Using Electro-Thermal Analysis

Relationships Between Supply Flow Rate of Small Cooling Fans and Pressure Drop Characteristics in Electronic Enclosure

Estimation of Heat Generation From Power Si MOSFET Using Electro-Thermal Analysis

Comparison Between PIV Results and CFD Simulations of Air Flows in a Thin Electronics Casing Model

Study on P-Q Curves of Cooling Fans for Thermal Design of Electronic Equipment (Effects of Opening Position of Obstructions Near a Fan)

Optimization of Natural Air Cooling in a Vertical Channel of Electronic Equipment

Thermal Resistance Measurement and Thermal Network Analysis of Printed Circuit Board With Thermal Vias

Investigation of Effect of Wiring Patterns on In-Plane Thermal Conductivity of Printed Circuit Boards

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