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Naotaka Tanaka
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Proceedings Papers

High-Density Room-Temperature 3D Chip-Stacking Using Mechanical Caulking With Compliant Bump and Through-Hole-Electrode

Naoya Watanabe, Michihiro Kawashita, Yasuhiro Yoshimura, Naotaka Tanaka, Tanemasa Asano
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 33-38, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89274
https://doi.org/10.1115/InterPACK2009-89274
View Paper titled, High-Density Room-Temperature 3D Chip-Stacking Using Mechanical Caulking With Compliant Bump and Through-Hole-Electrode
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Topics: Density, Electrodes, Temperature, Electroplating, Pattern formation
Proceedings Papers

Strength Evaluation of Conductive Adhesive Paste for Die Bonding During Reflow Soldering

Kisho Ashida, Kenya Kawano, Naotaka Tanaka, Atsushi Nishikizawa, Nobuya Koike
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 825-831, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89273
https://doi.org/10.1115/InterPACK2009-89273
View Paper titled, Strength Evaluation of Conductive Adhesive Paste for Die Bonding During Reflow Soldering
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Topics: Adhesives, Bonding, Reflow soldering, Silver, Fracture (Process), Fracture toughness, Copper, Failure, Resins, Stress
Proceedings Papers

Development of New Power MOSFETs Package With Double-Sided Cooling

Kisho Ashida, Akira Muto, Ichio Shimizu, Kenya Kawano, Naotaka Tanaka, Nae Yoneda
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 423-427, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33023
https://doi.org/10.1115/IPACK2007-33023
View Paper titled, Development of New Power MOSFETs Package With Double-Sided Cooling
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Topics: Cooling, Solders, Fracture (Materials), Thermal resistance, Copper, Fatigue, Fatigue life, Packaging, Structural optimization, Crack propagation
Journal Articles

A Highly Reliable Design for a Nonmetallurgical Contact-Joint Structure Consisting of an Adhesive Film

Naotaka Tanaka, Senior Researcher, Kenya Kawano, Researcher, Hideo Miura, Chief Researcher, Yoshiyuki Kado, Engineer, Ikuo Yoshida, Senior Engineer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 82–86.
https://doi.org/10.1115/1.1648059
Published Online: April 30, 2004
View Articletitled, A Highly Reliable Design for a Nonmetallurgical Contact-Joint Structure Consisting of an Adhesive Film
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Topics: Adhesives, Deformation, Relaxation (Physics), Reliability, Stress, Temperature, Design, Glass transition, Elasticity
Journal Articles

A New Method for Measuring Adhesion Strength of IC Molding Compounds

Asao Nishimura, Isao Hirose, Naotaka Tanaka
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1992, 114(4): 407–412.
https://doi.org/10.1115/1.2905473
Published Online: December 1, 1992
View Articletitled, A New Method for Measuring Adhesion Strength of IC Molding Compounds
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Topics: Adhesion, Molding, Stress, Alloys, Design, Dimensions, Evaluation methods, Fracture (Materials), Stress analysis (Engineering), Structural design