1-8 of 8
Nuno Rebelo
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

A Modular Nitinol Model With Lode Angle-Based Asymmetry and Improved Representation of the Superelastic Loops for Medical Device Applications

John Mould, Alex Kelly, Ash Peterson, Nuno Rebelo
Journal: Journal of Medical Devices
Publisher: ASME
Article Type: Technical Briefs
J. Med. Devices. June 2024, 18(2): 024501.
Paper No: MED-23-1125
https://doi.org/10.1115/1.4065513
Published Online: May 30, 2024
View Article titled, A Modular Nitinol Model With Lode Angle-Based Asymmetry and Improved Representation of the Superelastic Loops for Medical Device Applications
Open the PDF for A Modular Nitinol Model With Lode Angle-Based Asymmetry and Improved Representation of the Superelastic Loops for Medical Device Applications in another window
Topics: Compression, Medical devices, Tension, Nickel titanium alloys, Shear (Mechanics), Stress
Journal Articles

Two Calculation Verification Metrics Used in the Medical Device Industry: Revisiting the Limitations of Fractional Change

Ismail Guler, Kenneth I. Aycock, Nuno Rebelo
Journal: Journal of Verification, Validation and Uncertainty Quantification
Publisher: ASME
Article Type: Research-Article
J. Verif. Valid. Uncert. September 2022, 7(3): 031004.
Paper No: VVUQ-22-1008
https://doi.org/10.1115/1.4055506
Published Online: September 19, 2022
View Article titled, Two Calculation Verification Metrics Used in the Medical Device Industry: Revisiting the Limitations of Fractional Change
Open the PDF for Two Calculation Verification Metrics Used in the Medical Device Industry: Revisiting the Limitations of Fractional Change in another window
Topics: Errors, Stents, Uncertainty, Finite element analysis, Boundary-value problems, Nickel titanium alloys, Medical devices
Journal Articles

Method for Calibration of Left Ventricle Material Properties Using Three-Dimensional Echocardiography Endocardial Strains

Yaghoub Dabiri, Kevin L. Sack, Nuno Rebelo, Peter Wang, Yunjie Wang, Jenny S. Choy, Ghassan S. Kassab, Julius M. Guccione
Journal: Journal of Biomechanical Engineering
Publisher: ASME
Article Type: Research-Article
J Biomech Eng. September 2019, 141(9): 091007.
Paper No: BIO-19-1079
https://doi.org/10.1115/1.4044215
Published Online: August 2, 2019
View Article titled, Method for Calibration of Left Ventricle Material Properties Using Three-Dimensional Echocardiography Endocardial Strains
Open the PDF for Method for Calibration of Left Ventricle Material Properties Using Three-Dimensional Echocardiography Endocardial Strains in another window
Topics: Calibration, Echocardiography, Optimization, Geometry, Materials properties, Mechanical properties, Magnetic resonance imaging
Journal Articles

Validating Fatigue Safety Factor Calculation Methods for Cardiovascular Stents

Ramesh Marrey, Brian Baillargeon, Maureen L. Dreher, Jason D. Weaver, Srinidhi Nagaraja, Nuno Rebelo, Xiao-Yan Gong
Journal: Journal of Biomechanical Engineering
Publisher: ASME
Article Type: Research-Article
J Biomech Eng. June 2018, 140(6): 061001.
Paper No: BIO-17-1179
https://doi.org/10.1115/1.4039173
Published Online: March 16, 2018
View Article titled, Validating Fatigue Safety Factor Calculation Methods for Cardiovascular Stents
Open the PDF for Validating Fatigue Safety Factor Calculation Methods for Cardiovascular Stents in another window
Topics: Fatigue, Safety, Stents, Stress, Tensors, Scalars, Cycles, Cardiovascular system, Deformation, Fracture (Materials)
Journal Articles

On Modeling Assumptions in Finite Element Analysis of Stents

Nuno Rebelo, Rob Radford, Achim Zipse, Martin Schlun, Gael Dreher
Journal: Journal of Medical Devices
Publisher: ASME
Article Type: Research Papers
J. Med. Devices. September 2011, 5(3): 031007.
https://doi.org/10.1115/1.4004654
Published Online: August 15, 2011
View Article titled, On Modeling Assumptions in Finite Element Analysis of Stents
Open the PDF for On Modeling Assumptions in Finite Element Analysis of Stents in another window
Topics: Diamonds, Finite element analysis, Modeling, Stents, Manufacturing, Fatigue, Shapes, Nickel titanium alloys, Simulation, Dimensions
Journal Articles

On Modeling Assumptions in FEA of Stents

Nuno Rebelo, Rob Radford, Achim Zipse, Martin Schlun, Gael Dreher
Journal: Journal of Medical Devices
Publisher: ASME
Article Type: Design Of Medical Devices Conference Abstracts
J. Med. Devices. June 2011, 5(2): 027506.
https://doi.org/10.1115/1.3589230
Published Online: June 9, 2011
View Article titled, On Modeling Assumptions in FEA of Stents
Open the PDF for On Modeling Assumptions in FEA of Stents in another window
Topics: Finite element analysis, Modeling, Stents, Biomaterials, Biomedical equipment, Electrolytic polishing, Nickel alloys, Titanium alloys
Proceedings Papers

Cyclic Property of Nitinol and Its Impact on Finite Element Analysis

Xiao-Yan Gong, Nuno Rebelo, N. Morgan, Alan R. Pelton
Proc. ASME. NANOBIO2006, ASME 2006 Frontiers in Biomedical Devices Conference, 9-10, June 8–9, 2006
Publisher: American Society of Mechanical Engineers
Paper No: NANOBIO2006-18028
https://doi.org/10.1115/NANOBIO2006-18028
View Paper titled, Cyclic Property of Nitinol and Its Impact on Finite Element Analysis
Open the PDF for Cyclic Property of Nitinol and Its Impact on Finite Element Analysis in another window
Topics: Finite element analysis, Nickel titanium alloys, Fatigue, Modeling
Proceedings Papers

Automation and Customization of Chip Scale Modeling for Electronic Packaging

Nuno Rebelo, Shashwat Sinha, David Cadge
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 451-457, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-15725
https://doi.org/10.1115/IMECE2006-15725
View Paper titled, Automation and Customization of Chip Scale Modeling for Electronic Packaging
Open the PDF for Automation and Customization of Chip Scale Modeling for Electronic Packaging in another window
Topics: Electronic packaging, Fatigue, Modeling, Solders, Computer-aided engineering, Design, Absorption, Ball-Grid-Array packaging, Creep, Desorption