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Qizhou Yao
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Proceedings Papers

Three-Dimensional Finite Element Modeling of Flip Chip Packages Under Thermal Loading

Qizhou Yao, Jianmin Qu
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 779-787, November 15–20, 1998
Paper No: IMECE1998-1092
https://doi.org/10.1115/IMECE1998-1092
View Paper titled, Three-Dimensional Finite Element Modeling of Flip Chip Packages Under Thermal Loading
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Topics: Finite element analysis, Flip-chip packages, Modeling, Deflection, Flip-chip assemblies, Printed circuit boards, Stress, Design, Multi-chip modules, Size effect
Proceedings Papers

Effect of Thermal Residual Stresses on Polymer/Metal Interfacial Adhesion

Qizhou Yao, Jianmin Qu
Proc. ASME. IMECE99, Polymeric Systems, 25-28, November 14–19, 1999
Paper No: IMECE1999-1201
https://doi.org/10.1115/IMECE1999-1201
View Paper titled, Effect of Thermal Residual Stresses on Polymer/Metal Interfacial Adhesion
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Topics: Adhesion, Metals, Polymers, Residual stresses, Adhesives, Stress, Aluminum, Epoxy adhesives, Epoxy resins, Fracture (Materials)
Proceedings Papers

Interfacial Versus Cohesive Failure on Underfill-Aluminum Interface: Effects of Interface Roughness

Qizhou Yao, Jianmin Qu
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 153-160, November 5–10, 2000
Paper No: IMECE2000-2257
https://doi.org/10.1115/IMECE2000-2257
View Paper titled, Interfacial Versus Cohesive Failure on Underfill-Aluminum Interface: Effects of Interface Roughness
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Topics: Aluminum, Failure, Interface roughness, Polymers, Adhesion, Metals, Fracture mechanics, Surface roughness, Epoxy adhesives, Epoxy resins
Journal Articles

Interfacial Versus Cohesive Failure on Polymer-Metal Interfaces in Electronic Packaging—Effects of Interface Roughness

Qizhou Yao, Jianmin Qu
Journal: Journal of Electronic Packaging
Article Type: Papers On Reliability
J. Electron. Packag. June 2002, 124(2): 127–134.
https://doi.org/10.1115/1.1459470
Published Online: May 2, 2002
View Article titled, Interfacial Versus Cohesive Failure on Polymer-Metal Interfaces in Electronic Packaging—Effects of Interface Roughness
Open the PDF for Interfacial Versus Cohesive Failure on Polymer-Metal Interfaces in Electronic Packaging—Effects of Interface Roughness in another window
Topics: Adhesion, Electronic packaging, Failure, Fracture (Materials), Metals, Polymers, Surface roughness, Interface roughness, Aluminum, Fracture mechanics