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R. C. Jaeger
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Proceedings Papers

Characterization of Plastic Packages Using (100) Silicon Stress Test Chips

Y. Zou, J. C. Suhling, R. C. Jaeger, S. T. Lin, L. Nguyen, S. A. Gee
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 15-21, November 16–21, 1997
Paper No: IMECE1997-1222
DOI: https://doi.org/10.1115/IMECE1997-1222
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Topics: Silicon, Stress, Finite element analysis, Temperature, Constitutive equations, Electronic packaging, Engineering simulation, Packaging, Sensors, Shear stress
Proceedings Papers

Hydrostatic Response of Piezoresistive Stress Sensors

Y. Kang, A. K. M. Mian, J. C. Suhling, R. C. Jaeger
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 29-36, November 16–21, 1997
Paper No: IMECE1997-1224
DOI: https://doi.org/10.1115/IMECE1997-1224
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Topics: Hydrostatics, Sensors, Stress, Hydrostatic testing, Resistors, Calibration, Manufacturing, Pressure, Pressure vessels, Semiconductor wafers
Proceedings Papers

Evaluation of Die Stress Using van der Pauw Sensors

A. K. M. Mian, J. C. Suhling, R. C. Jaeger, B. M. Wilamowski
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 59-67, November 16–21, 1997
Paper No: IMECE1997-1228
DOI: https://doi.org/10.1115/IMECE1997-1228
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Topics: Sensors, Stress, Resistors, Silicon, Anisotropy, Electronic packaging, Heat conduction, Semiconductor wafers, Simulation results, Temperature
Proceedings Papers

Piezoresistive Theory for 4H Silicon Carbide Stress Sensors on Four-Degree Off-Axis Wafers

Jun Chen, R. C. Jaeger, J. C. Suhling
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A019, October 7–9, 2019
Paper No: IPACK2019-6461
DOI: https://doi.org/10.1115/IPACK2019-6461
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Topics: Semiconductor wafers, Sensors, Silicon, Stress, Calibration, Errors, Approximation, Design, Electronics, High temperature
Journal Articles

Optimal Sizing of Planar Thermal Spreaders

S. Hingorani, C. J. Fahrner, D. W. Mackowski, J. S. Gooding, R. C. Jaeger
Journal: Journal of Heat Transfer
Article Type: Research Papers
J. Heat Transfer. May 1994, 116(2): 296–301.
DOI: https://doi.org/10.1115/1.2911399
Published Online: May 1, 1994
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Topics: Dimensions, Heat conduction, Heat flux, Heat transfer, Packaging, Temperature
Journal Articles

An Integral Heat Sink for Cooling Microelectronic Components

S. H. Bhavnani, C.-P. Tsai, R. C. Jaeger, D. L. Eison
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 284–291.
DOI: https://doi.org/10.1115/1.2909330
Published Online: September 1, 1993
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Topics: Cooling, Heat sinks, Boiling, Heat, Silicon, Cavities, Atmospheric pressure, Etching, Flux (Metallurgy), Heat transfer
Journal Articles

Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages

D. A. Bittle, J. C. Suhling, R. E. Beaty, R. C. Jaeger, R. W. Johnson
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 203–215.
DOI: https://doi.org/10.1115/1.2905397
Published Online: September 1, 1991
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Topics: Electronic packages, Sensors, Stress, Structural analysis, Semiconductor wafers, Crystals, Design, Diamonds, Heat conduction, Integrated circuits