1-3 of 3
Takane Usui
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Exploring Cellular Tensegrity: Physical Modeling and Computational Simulation

Chun hua Zheng, Joseph Doll, Emily Gu, Elizabeth Hager-Barnard, Zubin Huang, AmirAli Kia, Monica Ortiz, Bryan Petzold, Takane Usui, Ronald Kwon, Christopher Jacobs, Ellen Kuhl
Proc. ASME. SBC2008, ASME 2008 Summer Bioengineering Conference, Parts A and B, 283-284, June 25–29, 2008
Paper No: SBC2008-192407
DOI: https://doi.org/10.1115/SBC2008-192407
View Paper
PDF
Topics: Modeling, Simulation, Tensegrity, Design, Geodesic domes, Gravity (Force), Stability, Students, Tension, Tumors
Proceedings Papers

Nanoscale Heat Conduction Across Metal-Dielectric Interfaces

Y. Sungtaek Ju, Ming-Tsung Hung, Takane Usui
Proc. ASME. HT2005, Heat Transfer: Volume 1, 205-212, July 17–22, 2005
Paper No: HT2005-72364
DOI: https://doi.org/10.1115/HT2005-72364
View Paper
PDF
Topics: Heat conduction, Metals, Nanoscale phenomena, Temperature, Electrons, Junctions, Nanoscale devices, Phonons, Thermal management, Thin films
Journal Articles

Nanoscale Heat Conduction Across Metal-Dielectric Interfaces

Y. “Sungtaek” Ju, Ming-Tsung Hung, Takane Usui
Journal: Journal of Heat Transfer
Article Type: Research Papers
J. Heat Transfer. September 2006, 128(9): 919–925.
DOI: https://doi.org/10.1115/1.2241839
Published Online: March 1, 2006
View Article
PDF
Topics: Electrons, Heat conduction, Junctions, Metals, Phonons, Temperature, Thermal resistance, Nanoscale phenomena, Thermal conductivity, Electrodes