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Journal Articles

Experimental Study of a Novel Centrifugal Compressor With Two Successive and Independent Rotors

Van-Thang Nguyen, Cheikh Brahim Abed, Amelie Danlos, Florent Ravelet, Richard Paridaens, Michael Deligant, Sofiane Khelladi, Farid Bakir

J. Eng. Gas Turbines Power. January 2022, 144(1): 011005.

Paper No: GTP-21-1134

DOI: https://doi.org/10.1115/1.4052506

Published Online: October 13, 2021

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Topics: Compressors, Rotors, Pressure, Flow (Dynamics)

Proceedings Papers

On the State Estimation of an Agonistic-Antagonistic Muscle System

Thang Nguyen, Holly Warner, Hanieh Mohammadi, Dan Simon, Hanz Richter

Proc. ASME. DSCC2017, Volume 1: Aerospace Applications; Advances in Control Design Methods; Bio Engineering Applications; Advances in Non-Linear Control; Adaptive and Intelligent Systems Control; Advances in Wind Energy Systems; Advances in Robotics; Assistive and Rehabilitation Robotics; Biomedical and Neural Systems Modeling, Diagnostics, and Control; Bio-Mechatronics and Physical Human Robot; Advanced Driver Assistance Systems and Autonomous Vehicles; Automotive Systems, V001T37A005, October 11–13, 2017

Paper No: DSCC2017-5304

DOI: https://doi.org/10.1115/DSCC2017-5304

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Topics: Muscle, State estimation, Errors, Noise (Sound), Signals, Springs, Trajectories (Physics)

Proceedings Papers

Biomechanical Design of a Novel Six DOF Compliant Prosthetic Ankle-Foot 2.0 for Rehabilitation of Amputee

Tan Thang Nguyen, Thanh-Phong Dao, Shyh-Chour Huang

Proc. ASME. IDETC-CIE2017, Volume 5A: 41st Mechanisms and Robotics Conference, V05AT08A013, August 6–9, 2017

Paper No: DETC2017-67700

DOI: https://doi.org/10.1115/DETC2017-67700

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Topics: Artificial limbs, Biomechanics, Design, Glass reinforced plastics, Composite materials, Deformation, Evolutionary algorithms, Finite element analysis, Stress, Taguchi methods

Proceedings Papers

Thinner Thermal Solution Module by Combination of Thin Heat Pipe and Piezo Fan

Ahmad Jalilvand, Masataka Mochizuki, Yuji Saito, Yoji Kawahara, Vijit Wuttijumnong, Thang Nguyen

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 367-375, July 6–8, 2011

Paper No: IPACK2011-52267

DOI: https://doi.org/10.1115/IPACK2011-52267

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Topics: Diluents, Heat pipes, Cooling, Laptop computers, Packaging, Acoustics, Condensers (steam plant), Density, Flat heat pipes, Heat

Proceedings Papers

Contribution of Heat Pipe to the Energy Conservation of Data Center and Cloud Computers

Masataka Mochizuki, Thang Nguyen, Koichi Mashiko, Yuji Saito, Xiao Ping Wu, Tien Nguyen, Vijit Wuttijumnong, Randeep Singh

Paper No: IPACK2011-52265

DOI: https://doi.org/10.1115/IPACK2011-52265

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Topics: Computers, Data centers, Energy conservation, Heat pipes, Energy storage, Design, Storage, Water storage, Climate change, Control systems

Proceedings Papers

Data Center Energy Conservation by Heat Pipe Cold Energy Storage System

Xiao Ping Wu, Masataka Mochizuki, Koichi Mashiko, Thang Nguyen, Tien Nguyen, Vijit Wuttijumnong, Gerald Cabusao, Randeep Singh, Aliakbar Akbarzadeh

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 701-709, August 8–13, 2010

Paper No: IHTC14-23128

DOI: https://doi.org/10.1115/IHTC14-23128

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Topics: Data centers, Energy conservation, Energy storage, Heat pipes

Proceedings Papers

Development of High Performance Thin Heat Pipe for Cooling Small Form Factor Devices

Masataka Mochizuki, Thang Nguyen, Yuji Saito, Tien Nguyen, Vijit Wuttijumnong, Mohammad Shahed Ahamed

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 5, 453-457, August 8–13, 2010

Paper No: IHTC14-23127

DOI: https://doi.org/10.1115/IHTC14-23127

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Topics: Cooling, Heat pipes, Operating temperature, Computer technology, Diluents, Electrical measurement, Electronic components, Gravity (Force), Heat transfer, Space

Proceedings Papers

Application of Micro-Channel Fin for Cold Plate of Liquid Cooling System and Vapor Chamber

Koichi Mashiko, Masataka Mochizuki, Yuji Saito, Yasuhiro Horiuchi, Thang Nguyen, Xiao Ping, Tien Nguyen, Vijit Wuttijumnong

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 389-394, July 19–23, 2009

Paper No: InterPACK2009-89144

DOI: https://doi.org/10.1115/InterPACK2009-89144

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Topics: Cooling, Cooling systems, Microchannels, Vapors

Proceedings Papers

Advanced Micro-Channel Vapor Chamber for Cooling High Power Processors

Masataka Mochizuki, Yuji Saito, Fumitoshi Kiyooka, Thang Nguyen, Tien Nguyen, Vijit Wuttijumnong

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 695-702, July 8–12, 2007

Paper No: IPACK2007-33611

DOI: https://doi.org/10.1115/IPACK2007-33611

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Topics: Cooling, Heat pipes, Microchannels, Vapors

Proceedings Papers

Characterization of Cryogen Spray Cooling With Thin-Film Thermocouple

Wangcun Jia, Thang Nguyen, Jaskaran Gill, J. Stuart Nelson

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 749-753, July 8–12, 2007

Paper No: HT2007-32222

DOI: https://doi.org/10.1115/HT2007-32222

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Topics: Cooling, Sprays, Thermocouples, Thin films, Skin, Lasers, Surgery, Temperature, Epoxy adhesives, Epoxy resins

Proceedings Papers

Development of Miniature Loop Heat Pipes for the Thermal Control of Laptops

Masataka Mochizuki, Yuji Saito, Thang Nguyen, Tien Nguyen, Vijit Wuttijumnong, Yasuhiro Horiuchi, Roj Tacomkang, Randeep Singh, Aliakbar Akbarzadeh

Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 969-974, June 6–9, 2008

Paper No: MNHT2008-52088

DOI: https://doi.org/10.1115/MNHT2008-52088

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Topics: Cooling, Heat pipes, Laptop computers

Proceedings Papers

Flat Miniature Heat Pipe With Composite Fibre Wick Structure for Cooling of Mobile Handheld Devices

Randeep Singh, Aliakbar Akbarzadeh, Mastaka Mochizuki, Yuji Saito, Thang Nguyen, Bob Kao, Tanaphan Sataphan, Eiji Takenaka, Vijit Wuttijumnong

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 409-414, July 17–22, 2005

Paper No: IPACK2005-73278

DOI: https://doi.org/10.1115/IPACK2005-73278

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Topics: Composite materials, Cooling, Fibers, Heat pipes

Proceedings Papers

Revolution in Fan Heat Sink Cooling Technology to Extend and Maximize Air Cooling for High Performance Processors in Laptop / Desktop / Server Application

Masataka Mochizuki, Yuji Saito, Thang Nguyen, Vijit Wuttijumnong, Xiaoping Wu, Tien Nguyen

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 431-437, July 17–22, 2005

Paper No: IPACK2005-73286

DOI: https://doi.org/10.1115/IPACK2005-73286

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Topics: Cooling, Heat pipes, Heat sinks, Laptop computers, Vapors, Energy dissipation, Heat, Clocks, Design, Heat flux

Proceedings Papers

Experimental Investigation of the Miniature Loop Heat Pipe With Flat Evaporator

Randeep Singh, Aliakbar Akbarzadeh, Masataka Mochizuki, Thang Nguyen, Vijit Wuttijumnong

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 697-702, July 17–22, 2005

Paper No: IPACK2005-73498

DOI: https://doi.org/10.1115/IPACK2005-73498

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Topics: Computer cooling, Heat pipes

Proceedings Papers

A Closed Loop Impinging Jet Cooling for Computer Chip

Jemmy Sutanto Bintoro, Aliakbar Akbarzadeh, Masataka Mochizuki, Thang Nguyen

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 349-355, November 15–21, 2003

Paper No: IMECE2003-43865

DOI: https://doi.org/10.1115/IMECE2003-43865

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Topics: Cooling, Integrated circuits, Temperature, Cooling systems, Heat exchangers, Heat, Heat flux, Rankine cycle

Journal citation

NARROW

Experimental Study of a Novel Centrifugal Compressor With Two Successive and Independent Rotors

On the State Estimation of an Agonistic-Antagonistic Muscle System

Biomechanical Design of a Novel Six DOF Compliant Prosthetic Ankle-Foot 2.0 for Rehabilitation of Amputee

Thinner Thermal Solution Module by Combination of Thin Heat Pipe and Piezo Fan

Contribution of Heat Pipe to the Energy Conservation of Data Center and Cloud Computers

Data Center Energy Conservation by Heat Pipe Cold Energy Storage System

Development of High Performance Thin Heat Pipe for Cooling Small Form Factor Devices

Application of Micro-Channel Fin for Cold Plate of Liquid Cooling System and Vapor Chamber

Advanced Micro-Channel Vapor Chamber for Cooling High Power Processors

Characterization of Cryogen Spray Cooling With Thin-Film Thermocouple

Development of Miniature Loop Heat Pipes for the Thermal Control of Laptops

Flat Miniature Heat Pipe With Composite Fibre Wick Structure for Cooling of Mobile Handheld Devices

Revolution in Fan Heat Sink Cooling Technology to Extend and Maximize Air Cooling for High Performance Processors in Laptop / Desktop / Server Application

Experimental Investigation of the Miniature Loop Heat Pipe With Flat Evaporator

A Closed Loop Impinging Jet Cooling for Computer Chip

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