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J. Thermal Sci. Eng. Appl. March 2012, 4(1): 011001. doi: https://doi.org/10.1115/1.4005602
J. Thermal Sci. Eng. Appl. March 2012, 4(1): 011002. doi: https://doi.org/10.1115/1.4005604
J. Thermal Sci. Eng. Appl. March 2012, 4(1): 011003. doi: https://doi.org/10.1115/1.4005606
J. Thermal Sci. Eng. Appl. March 2012, 4(1): 011004. doi: https://doi.org/10.1115/1.4005194
J. Thermal Sci. Eng. Appl. March 2012, 4(1): 011005. doi: https://doi.org/10.1115/1.4003923
J. Thermal Sci. Eng. Appl. March 2012, 4(1): 011006. doi: https://doi.org/10.1115/1.4005195
J. Thermal Sci. Eng. Appl. March 2012, 4(1): 011007. doi: https://doi.org/10.1115/1.4005209
J. Thermal Sci. Eng. Appl. March 2012, 4(1): 011008. doi: https://doi.org/10.1115/1.4005210
J. Thermal Sci. Eng. Appl. March 2012, 4(1): 011009. doi: https://doi.org/10.1115/1.4005256
J. Thermal Sci. Eng. Appl. March 2012, 4(1): 011010. doi: https://doi.org/10.1115/1.4005287
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