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J. Thermal Sci. Eng. Appl. March 2013, 5(1): 011001. doi: https://doi.org/10.1115/1.4007277
J. Thermal Sci. Eng. Appl. March 2013, 5(1): 011002. doi: https://doi.org/10.1115/1.4007777
J. Thermal Sci. Eng. Appl. March 2013, 5(1): 011003. doi: https://doi.org/10.1115/1.4007439
J. Thermal Sci. Eng. Appl. March 2013, 5(1): 011004. doi: https://doi.org/10.1115/1.4007778
J. Thermal Sci. Eng. Appl. March 2013, 5(1): 011005. doi: https://doi.org/10.1115/1.4007498
J. Thermal Sci. Eng. Appl. March 2013, 5(1): 011006. doi: https://doi.org/10.1115/1.4007916
J. Thermal Sci. Eng. Appl. March 2013, 5(1): 011007. doi: https://doi.org/10.1115/1.4007437
J. Thermal Sci. Eng. Appl. March 2013, 5(1): 011008. doi: https://doi.org/10.1115/1.4007914
J. Thermal Sci. Eng. Appl. March 2013, 5(1): 011009. doi: https://doi.org/10.1115/1.4007578
J. Thermal Sci. Eng. Appl. March 2013, 5(1): 011010. doi: https://doi.org/10.1115/1.4007860
J. Thermal Sci. Eng. Appl. March 2013, 5(1): 011011. doi: https://doi.org/10.1115/1.4007919
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