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Journal Articles

Embedded Microfluidic Cooling in Aluminum Nitride HTCC Substrate for High-Power Radio Frequency Chip Array

Yupu Ma, Tao Wei, Jiyu Qian, Jian Peng
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. October 2023, 15(10): 101004.
Paper No: TSEA-23-1003
https://doi.org/10.1115/1.4062400
Published Online: June 26, 2023
View Article titled, Embedded Microfluidic Cooling in Aluminum Nitride HTCC Substrate for High-Power Radio Frequency Chip Array
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Topics: Aluminum, Cooling, Heat, Microchannels, Microfluidics, Shells, Simulation, Temperature, Energy dissipation, Heating
Journal Articles

A Highly Efficient Integrated Silicon-Microchannel Cooler for Multi-Module Electronic Microsystems: Model Design, Optimization, and Performance Validation

Jiejun Wang, Tao Wang, Qiuyan Li, Yiming Li, Chuangui Wu, Wanli Zhang
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. October 2021, 13(5): 051016.
Paper No: TSEA-20-1273
https://doi.org/10.1115/1.4049433
Published Online: March 10, 2021
View Article titled, A Highly Efficient Integrated Silicon-Microchannel Cooler for Multi-Module Electronic Microsystems: Model Design, Optimization, and Performance Validation
Open the PDF for A Highly Efficient Integrated Silicon-Microchannel Cooler for Multi-Module Electronic Microsystems: Model Design, Optimization, and Performance Validation in another window
Topics: Cooling, Microchannels, Coolants, Microelectromechanical systems, Temperature, Heat, Flow (Dynamics), Fluids, Silicon, Heat transfer
Journal Articles

Opto-Electro-Thermal Modeling of Thin-Film Hydrogenated Amorphous Silicon (a-Si:H) Photovoltaic Cell

Jia-Jiun Lai, Basil T. Wong, Jasman Y.-H. Chai
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. August 2021, 13(4): 041013.
Paper No: TSEA-20-1319
https://doi.org/10.1115/1.4048838
Published Online: January 18, 2021
View Article titled, Opto-Electro-Thermal Modeling of Thin-Film Hydrogenated Amorphous Silicon (a-Si:H) Photovoltaic Cell
Open the PDF for Opto-Electro-Thermal Modeling of Thin-Film Hydrogenated Amorphous Silicon (a-Si:H) Photovoltaic Cell in another window
Topics: Acoustics, Electrons, Modeling, Phonons, Photovoltaic cells, Silicon, Temperature, Thin films, Simulation, Boundary-value problems
Journal Articles

Computational Study of Contact Solidification for Silicon Film Growth in the Ribbon Growth on Substrate System

Samin Askarian, Ronghui Ma
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. March 2014, 6(1): 011011.
Paper No: TSEA-13-1040
https://doi.org/10.1115/1.4025050
Published Online: October 25, 2013
View Article titled, Computational Study of Contact Solidification for Silicon Film Growth in the Ribbon Growth on Substrate System
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Topics: Heat transfer, Silicon, Solidification, Temperature
Journal Articles

Heat Transfer During Multiwire Sawing of Silicon Wafers

Lars Johnsen, Jan Erik Olsen, Trond Bergstrøm, Kay Gastinger
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2012, 4(3): 031006.
https://doi.org/10.1115/1.4006591
Published Online: July 16, 2012
View Article titled, Heat Transfer During Multiwire Sawing of Silicon Wafers
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Topics: Heat transfer, Sawing, Semiconductor wafers, Slurries, Temperature, Wire, Silicon, Modeling, Heat
Journal Articles

Development of Scalable Silicon Heat Spreader for High Power Electronic Devices

Qingjun Cai, Bing-Chung Chen, Chailun Tsai, Chung-lung Chen
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2009, 1(4): 041009.
https://doi.org/10.1115/1.4001689
Published Online: June 24, 2010
View Article titled, Development of Scalable Silicon Heat Spreader for High Power Electronic Devices
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Topics: Bonding, Flat heat pipes, Pressure, Silicon, Temperature, Vacuum, Vapors, Sealing (Process), Leakage, Heat flux