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Keywords: silicon
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Journal Articles
Article Type: Discussions
J. Tribol. January 2010, 132(1): 015501.
Published Online: November 11, 2009
...H. A. Abdel-Aal 12 09 2007 28 08 2009 11 11 2009 11 11 2009 diamond germanium metal-insulator transition photoemission silicon triboelectricity wear The authors observed that the strength of triboemission, for diamond-Si and diamond-Ge pairs, decreased...
Journal Articles
Article Type: Research Papers
J. Tribol. July 2009, 131(3): 031402.
Published Online: June 1, 2009
... and unloading curves from the indentation experiment of a gold film on the silicon substrate. Unessential coefficients of the response surface are then removed based on the test statistics. Unlike the traditional methods of identification, the tip geometry of the indenter is included because its uncertainty...
Journal Articles
Article Type: Research Papers
J. Tribol. April 2008, 130(2): 021603.
Published Online: May 7, 2008
..., and hydrodynamic drag. The polishing experiments were carried out on silicon wafers with Si O 2 slurry. Cleaning experiments were performed in de-ionized water using a polyvinyl acetal brush to remove particles from a hydrophilic-silicon surface. The fluid-drag force was found to affect the lubricating behavior...
Journal Articles
Article Type: Technical Papers
J. Tribol. January 2007, 129(1): 11–16.
Published Online: June 27, 2006
...S. Ingole; A. Schwartzman; H. Liang Investigation of abrasive wear at the nanometer-length scale is presented on single crystalline (001) and amorphous silicon. Experiments were performed using nanoindentation and nanoscratch approaches. Surface characterization was carried out using an atomic...
Journal Articles
Article Type: Research Papers
J. Tribol. July 2006, 128(3): 445–459.
Published Online: March 8, 2006
...Jen Fin Lin; Sheng-Chao Chen; Yu Long Ouyang; Ming Shih Tsai An average Reynolds equation considering the effects of a pad’s annular grooves and surface roughness is developed in this study to examine mixed lubrication in the chemical mechanical polishing (CMP) of a copper-film silicon wafer...
Journal Articles
Article Type: Technical Papers
J. Tribol. January 2005, 127(1): 206–212.
Published Online: February 7, 2005
... of the silicon-based fabrication techniques originally used for microchips are now being used to construct MEMS components. These microscaled manufacturing techniques are making MEMS implementation an attractive design alternative to conventional technology. As the manufacturing of MEMS components becomes more...
Journal Articles
Article Type: Technical Papers
J. Tribol. July 2004, 126(3): 583–590.
Published Online: June 28, 2004
...Bharat Bhushan, Fellow ASME; Huiwen Liu; Stephen M. Hsu Tribological properties are crucial to the reliability of microelectromechanical systems/nanoelectromechanical systems (MEMS/NEMS). In this study, adhesion and friction measurements are made at micro and nanoscales on single-crystal silicon...
Journal Articles
Article Type: Technical Papers
J. Tribol. April 2004, 126(2): 360–366.
Published Online: April 19, 2004
...-carbon) protective layer, the silicon underlayer and the substrate. Then, the shift was subtracted from the optical spacing to obtain the mechanical spacing. Finally, the repeatedly measured mechanical spacings were compared with the theoretically calculated spacings, showing a good accordance between...
Journal Articles
Article Type: Technical Papers
J. Tribol. January 2004, 126(1): 185–199.
Published Online: January 13, 2004
...Jen Fin Lin, Professor; Junne Dar Chern; Yang Hui Chang; Ping Lin Kuo; Ming Shih Tsai In the chemical mechanical planarization of a copper-film silicon wafer, the average Reynolds equation with flow factors has also been developed for a cylindrical coordinate system to study the mixed lubrication...
Journal Articles
Article Type: Technical Papers
J. Tribol. January 2003, 125(1): 193–199.
Published Online: December 31, 2002
... measurements performed on silicon and gold interfaces. Finally, the significance of the interfacial forces as relate to the reliability of MEMS interfaces is discussed. Contributed by the Tribology Division for publication in the ASME JOURNAL OF TRIBOLOGY . Manuscript received by the Tribology Division...
Journal Articles
Article Type: Technical Papers
J. Tribol. April 2000, 122(2): 450–457.
Published Online: August 24, 1999
... experimental work on the polishing of single crystal silicon wafers with polyurethane pads and high pH slurries containing silica particles. Subambient pressures have important implications in the polishing rate and uniformity of silicon and, therefore, in the manufacture of large-scale integrated circuits...
Journal Articles
Article Type: Technical Papers
J. Tribol. July 2000, 122(3): 539–543.
Published Online: July 6, 1999
... the typical range of normal loads and velocities used in the chemical mechanical polishing/planarization of silicon wafers. The results show that, for most cases, the leading two-thirds of the fixture exhibits a subambient pressure, and the trailing third a positive pressure. The average pressure is sub...